Vertical silicon/silicon-germanium transistors with multiple threshold voltages
A method of forming vertical fin field effect transistors, including, forming a silicon-germanium cap layer on a substrate, forming at least four vertical fins and silicon-germanium caps from the silicon-germanium cap layer and the substrate, where at least two of the at least four vertical fins is in a first subset and at least two of the at least four vertical fins is in a second subset, forming a silicon-germanium doping layer on the plurality of vertical fins and silicon-germanium caps, removing the silicon-germanium doping layer from the at least two of the at least four vertical fins in the second subset, and removing the silicon-germanium cap from at least one of the at least two vertical fins in the first subset, and at least one of the at least two vertical fins in the second subset.
1. A method of forming vertical fin field effect transistors, comprising:
forming a silicon-germanium cap layer on a substrate;
forming a vertical fin with a silicon-germanium cap from the silicon-germanium cap layer and the substrate;
forming a silicon-germanium doping layer on the vertical fin and silicon-germanium cap; and
heat treating the vertical fin, silicon-germanium cap, and silicon-germanium doping layer to diffuse germanium into the vertical fin and substrate.
2. The method of claim 1 , wherein the germanium concentration in the vertical fin resulting from heat treating is in a range of about 40 at. % to about 60 at. %.
3. The method of claim 2 , wherein the germanium concentration in the vertical fin resulting from heat treating is in a range of about 50 at. % to about 60 at. %.
4. The method of claim 1 , further comprising removing the silicon-germanium doping layer before heat treating.
5. The method of claim 4 , wherein the germanium concentration in the vertical fin resulting from heat treating is in a range of about 5 at. % to about 30 at. %.
6. The method of claim 5 , wherein the germanium concentration in the vertical fin resulting from heat treating is in a range of about 10 at. % to about 20 at. %.
7. The method of claim 1 , further comprising removing the silicon-germanium cap from the vertical fin before heat treating.
8. The method of claim 7 , wherein the germanium concentration in the vertical fin resulting from heat treating is in a range of about 20 at. % to about 40 at. %.
9. The method of claim 1 , further comprising removing the silicon-germanium cap and the silicon-germanium doping layer from the vertical fin before heat treating.
10. The method of claim 9 , wherein the germanium concentration in the vertical fin resulting from heat treating is the same as the initial germanium concentration of the substrate.
11. A method of forming vertical fin field effect transistors with different threshold voltages, comprising:
forming a silicon-germanium cap layer on a substrate, wherein the silicon-germanium cap layer has a germanium concentration in the range of about 20 at. % to about 30 at. %;
forming a vertical fin with a silicon-germanium cap from the silicon-germanium cap layer and the substrate; and
forming a silicon-germanium doping layer directly on the exposed surfaces of the substrate, the vertical fin, and the silicon-germanium cap.
12. The method of claim 11 , wherein the silicon-germanium doping layer has a germanium concentration in a range of about 35 at. % to about 65 at. %.
13. The method of claim 12 , further comprising, forming a protective liner on the vertical fin and silicon-germanium cap, and removing a portion of the protective liner to expose the silicon-germanium cap, removing the silicon-germanium cap, and heat treating the vertical fin and silicon-germanium doping layer to diffuse germanium into the vertical fin and substrate.
14. The method of claim 12 , further comprising removing the silicon-germanium cap and the silicon-germanium doping layer from the vertical fin.
15. The method of claim 14 , further comprising heat treating the vertical fin.
16. A method of forming vertical fin field effect transistors, comprising:
forming a silicon-germanium cap layer on a substrate;
forming a vertical fin with a silicon-germanium cap from the silicon-germanium cap layer and the substrate;
forming a silicon-germanium doping layer directly on the exposed surfaces of the substrate, vertical fin, and silicon-germanium cap; and
forming a protective liner on the silicon-germanium doping layer and silicon-germanium cap.
17. The method of claim 16 , further comprising, removing a portion of the protective liner and the silicon-germanium cap, and heat treating the vertical fin and silicon-germanium doping layer to diffuse germanium into the vertical fin and substrate.
18. The method of claim 16 , further comprising removing the protective liner, and heat treating the vertical fin, silicon-germanium cap, and silicon-germanium doping layer to diffuse germanium into the vertical fin and substrate.
19. The method of claim 18 , wherein the heat treating is conducted in an oxidizing atmosphere, wherein an oxide layer is formed on the vertical fin and substrate.
20. The method of claim 19 , further comprising, removing the oxide layer from the outer surfaces of the vertical fin and substrate by a selective, isotropic etch.