Dual channel FinFETs having uniform fin heights
A method of making a semiconductor device including forming a first blanket layer on a substrate; forming a second blanket layer on the first blanket layer; patterning a first fin of a first transistor region and a second fin of a second transistor region in the first blanket layer and the second blanket layer; depositing a mask on the second transistor region; removing the first fin to form a trench; growing a first semiconductor layer in the trench where the first fin was removed; and growing a second semiconductor layer on the first semiconductor layer.
1. A method of making a semiconductor device, the method comprising:
forming a blanket layer of n-doped silicon on a silicon substrate;
forming a blanket layer of SiGe directly on the blanket layer of n-doped silicon, the blanket layer of SiGe being a single discrete layer of SiGe;
patterning a plurality of first fins of an n-type field effect transistor (NFET) and a plurality of second fins of a p-type field effect transistor (PFET) in the blanket layer of n-doped silicon and the blanket layer of SiGe;
depositing a dielectric material around the plurality of first fins and the plurality of second fins;
depositing a mask on the plurality of second fins of the PFET;
removing the plurality of first fins of the NFET to form a plurality of fin trenches in the dielectric material;
performing an epitaxial prebake process to round a-bottom edges of each of the plurality of fin trenches;
growing a p-doped silicon epitaxial layer in the plurality of fin trenches, the p-doped silicon epitaxial layer being a single discrete layer of silicon doped with a p-type dopant; and
growing a silicon epitaxial layer directly on the p-doped silicon epitaxial layer, the silicon epitaxial layer being a single discrete layer of silicon.
2. The method of claim 1 , further comprising depositing a hardmask on the blanket layer of SiGE before patterning the plurality of first fins and the plurality of second fins.
3. The method of claim 2 , further comprising recessing the silicon epitaxial layer and the dielectric material, and removing the hardmask before depositing a gate on the plurality of first fins.
4. The method of claim 1 , further comprising polishing a surface of the dielectric material after growing the silicon epitaxial layer to remove silicon overgrowth.
5. The method of claim 4 , further comprising recessing the silicon epitaxial layer and the dielectric material to form a plurality of silicon fins in the NFET.
6. The method of claim 5 , wherein the plurality of second fins of the PFET further comprises a hardmask cap, and the method further comprises removing the hardmask cap after growing the silicon epitaxial layer.
7. The method of claim 1 , further comprising forming a gate stack on the plurality of first fins.
8. The method of claim 7 , wherein the gate stack comprises a gate dielectric layer deposited directly on the silicon epitaxial layer and the blanket layer of SiGe.