IP Library › Granted Patent US 10,546,884
Granted Patent B2
US 10,546,884 · App. 16/065,942 · Granted Jan 28, 2020

Array substrate and manufacturing method thereof, and display device

Inventors: Ke Cao (Beijing, CN); Chengshao Yang (Beijing, CN); Jun Ma (Beijing, CN)
Assignees: BOE Technology Group Co., Ltd.; Hefei Xinsheng Optoelectronics Technology Co., Ltd.
H01L27/1248H01L27/1262H01L21/31111H01L27/1259H01L27/1274H01L29/66765H01L29/78678
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,546,884
App. No.
16/065,942
Granted
Jan 28, 2020
Kind
B2
Abstract

An array substrate and a manufacturing method thereof, and a display device are provided. The array substrate includes a base substrate; a planarization layer, located on the base substrate; a first electrode layer, located on a side of the planarization layer away from the base substrate; and an insulating layer, located on a side of the planarization layer and the first electrode layer away from the base substrate, the insulating layer includes a plurality of first pores.

Claims (36)

1. An array substrate, comprising:

a base substrate;

a planarization layer, located on the base substrate;

a first electrode layer, located on a surface of the planarization layer away from the base substrate; and

an insulating layer, located on a side of the planarization layer and the first electrode layer away from the base substrate,

wherein the insulating layer comprises a plurality of first pore structures, the planarization layer is in partial contact with the insulating layer, and at least one of the plurality of first pore structures is located in a contact region of the planarization layer and the insulating layer.

2. The array substrate according to claim 1 , wherein each of the first pore structures has a shape of ellipse.

3. The array substrate according to claim 2 , wherein long axis directions of adjacent ones of the first pore structures are perpendicular to each other.

4. The array substrate according to claim 1 , wherein each of the first pore structures has a shape of rectangle.

5. The array substrate according to claim 4 , wherein long edge directions of adjacent ones of the first pore structures are perpendicular to each other.

6. The array substrate according to claim 1 , further comprising:

a second electrode layer, located on a side of the insulating layer away from the first electrode layer, and comprising a plurality of openings,

wherein an orthographic projection of the second electrode layer on the base substrate is at least partially overlapped with an orthographic projection of the first electrode layer on the base substrate, in an overlapped region of the orthographic projections of the first electrode layer on the base substrate and the second electrode layer on the base substrate, an orthographic projection of the first pore structures on the base substrate falls into an orthographic projection of the openings on the base substrate.

7. The array substrate according to claim 6 , wherein the first electrode layer comprises a plurality of second pore structures, in the overlapped region of the orthographic projections of the first electrode layer on the base substrate and the second electrode layer on the base substrate, an orthographic projection of the second pore structures on the base substrate is overlapped with the orthographic projection of the first pore structures on the base substrate.

8. The array substrate according to claim 7 , wherein the plurality of first pore structures and the plurality of second pore structures are formed through a same patterning process.

9. The array substrate according to claim 1 , further comprising a thin film transistor located between the base substrate and the planarization layer.

10. The array substrate according to claim 1 , wherein a thermal expansion coefficient of the planarization layer is different from that of the insulating layer.

11. The array substrate according to claim 1 , wherein a material of the planarization layer comprises an organic material, and a material of the insulating layer comprises an inorganic material.

12. A display device, comprising the array substrate according to claim 1 .

13. A manufacturing method of an array substrate, comprising:

forming a planarization layer on a base substrate;

forming a first electrode layer on a surface of the planarization layer away from the base substrate;

forming an insulating layer on a side of the planarization layer and the first electrode layer away from the base substrate; and

patterning the insulating layer to form a plurality of first pore structures,

wherein the planarization layer is in partial contact with the insulating layer, and at least one of the plurality of first pore structures is located in a contact region of the planarization layer and the insulating layer.

14. The manufacturing method according to claim 13 , further comprising:

forming a second electrode layer on a side of the insulating layer away from the base substrate, wherein an orthographic projection of the second electrode layer on the base substrate is at least partially overlapped with an orthographic projection of the first electrode layer on the base substrate,

wherein the second electrode layer comprises a plurality of openings, in an overlapped region of the orthographic projections of the first electrode layer on the base substrate and the second electrode layer on the base substrate, an orthographic projection of the first pore structures on the base substrate falls into an orthographic projection of the openings on the base substrate.

15. The manufacturing method according to claim 13 , further comprising:

patterning the insulating layer and the first electrode layer by one patterning process, so as to form a plurality of second pore structures in the first electrode layer having a same shape as the plurality of first pore structures.

16. The manufacturing method according to claim 13 , wherein a thermal expansion coefficient of the planarization layer is different from that of the insulating layer.

17. The manufacturing method according to claim 13 , wherein a material of the planarization layer comprises an organic material, and a material of the insulating layer comprises an inorganic material.

18. The array substrate according to claim 2 , further comprising:

a second electrode layer, located on a side of the insulating layer away from the first electrode layer, and comprising a plurality of openings,

wherein an orthographic projection of the second electrode layer on the base substrate is at least partially overlapped with an orthographic projection of the first electrode layer on the base substrate, in an overlapped region of the orthographic projections of the first electrode layer on the base substrate and the second electrode layer on the base substrate, an orthographic projection of the first pore structures on the base substrate falls into an orthographic projection of the openings on the base substrate.

19. The array substrate according to claim 2 , wherein a thermal expansion coefficient of the planarization layer is different from that of the insulating layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2018
From: CAO, KE; YANG, CHENGSHAO; MA, JUN
To: BOE TECHNOLOGY GROUP CO., LTD.; HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 047249/0910 →
Priority Claims (1)
CN 2016 1 1094764 · Dec 2, 2016 · national
Continuity (1)
Related Publication 20190013338A1 · Jan 10, 2019