IP Library › Granted Patent US 10,553,404
Granted Patent B2
US 10,553,404 · App. 15/421,726 · Granted Feb 4, 2020

Adjustable extended electrode for edge uniformity control

Inventors: Olivier Luere (Sunnyvale, CA); Leonid Dorf (San Jose, CA); Sunil Srinivasan (Milpitas, CA); Rajinder Dhindsa (Pleasanton, CA); James Rogers (Los Gatos, CA); Denis M. Koosau (Pleasanton, CA)
Assignee: APPLIED MATERIALS, INC.
H01J37/32431H01J37/32009H01L21/6831H01L21/68735H01L21/68742H01J2237/334
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Quick Facts
Patent No.
US 10,553,404
App. No.
15/421,726
Granted
Feb 4, 2020
Kind
B2
Abstract

Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a ring having a first ring component and a second ring component, an adjustable tuning ring, and an actuating mechanism. The first ring component is interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween. The adjustable tuning ring is positioned beneath the ring and contacts a bottom surface of the second ring component. A top surface of the adjustable tuning ring contacts the second ring component. The actuating mechanism is interfaced with the bottom surface of the adjustable tuning ring. The actuating mechanism is configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component varies.

Claims (46)

1. A process kit for a substrate processing chamber, the process kit comprising:

a ring having a first ring component and a second ring component, the first ring component interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween;

an adjustable tuning ring positioned beneath the ring and contacting a bottom surface of the second ring component, the adjustable tuning ring having an annular body having a top surface and a bottom surface, a cavity formed in the bottom surface of the annular body, and an access orifice formed in the annular body, the access orifice extending from the top surface of the annular body into the cavity, the top surface of the annular body contacting the second ring component; and

an actuating mechanism interfaced with the bottom surface of the annular body of the adjustable tuning ring, the actuating mechanism being configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component is varied.

2. The process kit of claim 1 , wherein the adjustable tuning ring is formed from a conductive material.

3. The process kit of claim 1 , wherein the first ring component comprises:

a stepped surface formed therein.

4. The process kit of claim 3 , wherein the second ring component comprises:

a stepped surface formed therein, wherein the stepped surface of the second ring component interfaces with the stepped surface of the first ring component.

5. The process kit of claim 1 , wherein the actuating mechanism comprises:

a lift pin having a first end and a second end, the first end of the lift pin contacting the bottom surface of the annular body of the adjustable tuning ring, the second end of the lift pin in communication with a lift mechanism.

6. The process kit of claim 1 , wherein the actuating mechanism is a screw disposed at least partially in the cavity, the screw configured to be rotated through the access orifice to actuate the adjustable tuning ring.

7. The process kit of claim 1 , wherein the cavity has a first diameter and the access orifice has a second diameter, the first diameter being larger than the second diameter.

8. A process kit for a substrate processing chamber, the process kit comprising:

a ring having a first ring component and a second ring component, the first ring component interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween;

an adjustable tuning ring positioned beneath the ring and contacting a bottom surface of the second ring component, the adjustable tuning ring having a top surface and a bottom surface, the top surface of the adjustable tuning ring contacting the second ring component; and

an actuating mechanism interfaced with the bottom surface of the adjustable tuning ring, the actuating mechanism being configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component is varied, and the actuating mechanism being configured to push up and down a plasma sheath formed between a plasma and the ring while maintaining a plasma sheath thickness nearly constant.

9. The process kit of claim 8 , wherein the first ring component comprises a stepped surface formed therein, the second ring component comprises a stepped surface formed therein, and the stepped surface of the second ring component interfaces with the stepped surface of the first ring component.

10. The process kit of claim 8 , wherein the actuating mechanism comprises:

a lift pin having a first end and a second end, the first end of the lift pin contacting the bottom surface of the adjustable tuning ring, the second end of the lift pin in communication with a lift mechanism.

11. A processing chamber, comprising:

a substrate support member configured to support a substrate; and

a process kit supported by the substrate support member, the process kit comprising:

a ring having a first ring component and a second ring component, the first ring component interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween;

an adjustable tuning ring positioned beneath the ring and contacting a bottom surface of the second ring component, the adjustable tuning ring having an annular body having a top surface and a bottom surface, a cavity formed in the bottom surface of the annular body, and an access orifice formed in the annular body, the access orifice extending from the top surface of the annular body into the cavity, the top surface of the annular body contacting the second ring component; and

an actuating mechanism interfaced with the bottom surface of the annular body of the adjustable tuning ring, the actuating mechanism being configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component is varied.

12. The processing chamber of claim 11 , wherein the adjustable tuning ring is formed from a conductive material.

13. The processing chamber of claim 11 , wherein the first ring component comprises:

a stepped surface formed therein.

14. The processing chamber of claim 13 , wherein the second ring component comprises:

a stepped surface formed therein, wherein the stepped surface of the second ring component interfaces with the stepped surface of the first ring component.

15. The processing chamber of claim 11 , wherein the actuating mechanism comprises:

a lift pin having a first end and a second end, the first end of the lift pin contacting the bottom surface of the annular body of the adjustable tuning ring, the second end of the lift pin in communication with a lift mechanism.

16. The processing chamber of claim 11 , wherein the actuating mechanism is a screw disposed at least partially in the cavity, the screw configured to be rotated through the access orifice to actuate the adjustable tuning ring.

17. The processing chamber of claim 11 , wherein the cavity has a first diameter and the access orifice has a second diameter, the first diameter being larger than the second diameter.

18. A processing chamber, comprising:

a substrate support member configured to support a substrate; and

a process kit supported by the substrate support member, the process kit comprising:

a ring having a first ring component and a second ring component, the first ring component interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween;

an adjustable tuning ring positioned beneath the ring and contacting a bottom surface of the second ring component, the adjustable tuning ring having a top surface and a bottom surface, the top surface of the adjustable tuning ring contacting the second ring component; and

an actuating mechanism interfaced with the bottom surface of the adjustable tuning ring, the actuating mechanism being configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component is varied, and the actuating mechanism being configured to push up and down a plasma sheath formed between a plasma and the ring while maintaining a plasma sheath thickness nearly constant.

19. The processing chamber of claim 11 , wherein the substrate support member comprises:

a base;

a cooling plate supported by the base; and

an electrostatic chuck positioned on a top surface of the cooling plate.

20. The processing chamber of claim 18 , wherein the first ring component comprises a stepped surface formed therein, the second ring component comprises a stepped surface formed therein, and the stepped surface of the second ring component interfaces with the stepped surface of the first ring component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2017
From: LUERE, OLIVIER; DORF, LEONID; SRINIVASAN, SUNIL; DHINDSA, RAJINDER; ROGERS, JAMES; KOOSAU, DENIS M.
To: APPLIED MATERIALS, INC.
Reel/Frame 042750/0529 →
Continuity (1)
Related Publication 20180218933A1 · Aug 2, 2018
Cited By (1)
US 12,334,311