IP Library › Granted Patent US 10,553,531
Granted Patent B2
US 10,553,531 · App. 15/710,737 · Granted Feb 4, 2020

Process-invariant resistor and capacitor pair

Inventors: Chao Song (San Diego, CA); Xuhao Huang (San Diego, CA); Marzio Pedrali-Noy (San Diego, CA)
Assignee: QUALCOMM Incorporated
H01L23/5223H01L21/743H01L21/82H01L23/5222H01L23/5228H01L27/016H01L28/20H01L28/86H01P1/20336H05K3/303H01L2224/05085
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Quick Facts
Patent No.
US 10,553,531
App. No.
15/710,737
Granted
Feb 4, 2020
Kind
B2
Abstract

A process-invariant RC circuit is formed by patterning a metal layer using the same mask pattern to form a metal layer resistor and a metal layer capacitor. The same mask pattern results in the metal layer resistor and the metal layer capacitor each having a plurality of longitudinally-extending fingers having the same width and separation.

Claims (19)

1. A resistor-capacitor (RC) circuit comprising:

a plurality of leads in a first metal layer adjacent a semiconductor die, wherein the plurality of leads are configured into a metal layer resistor and configured into a metal layer capacitor that is coupled to the metal layer resistor, and wherein the plurality of leads have the same width; and wherein the plurality of leads includes a plurality of longitudinally-extending leads, a first set of longitudinally-extending fingers, and a second set of longitudinally-extending fingers;

the metal layer resistor including the plurality of longitudinally-extending leads, the plurality of longitudinally-extending leads being arranged in parallel according to a first gap between neighboring ones of the longitudinally-extending leads and coupled to each other; and

the metal layer capacitor including the first set of longitudinally-extending fingers and the second set of longitudinally-extending fingers, wherein the first set of longitudinally-extending fingers are interdigitated with the second set of longitudinally-extending fingers according to an interdigitation gap, and wherein the interdigitation gap equals the first gap.

2. The RC circuit of claim 1 , wherein the metal layer resistor includes a plurality of laterally-extending connectors configured to couple together the longitudinally-extending leads.

3. The RC circuit of claim 1 , wherein the metal layer resistor is connected in series with the metal layer capacitor.

4. The RC circuit of claim 1 , wherein the metal layer resistor is connected in parallel with the metal layer capacitor.

5. The RC circuit of claim 1 , wherein the metal layer resistor further includes a plurality of longitudinally-extending leads arranged in parallel in a second metal layer adjacent the semiconductor die according to the first gap between neighboring ones of the longitudinally-extending leads in the second metal layer.

6. The RC circuit of claim 1 , wherein the metal layer capacitor further includes a first set of longitudinally-extending fingers in a second metal layer adjacent the semiconductor die, wherein the first set of longitudinally-extending fingers in the second metal layer are interdigitated according to the interdigitation gap with a second set of longitudinally-extending fingers in the second metal layer.

7. The RC circuit of claim 1 wherein each longitudinally-extending lead extends across a first length, and wherein each longitudinally-extending finger extends across the first length.

8. The RC circuit of claim 1 , wherein the first metal layer is an aluminum metal layer.

9. The RC circuit of claim 1 , wherein the first metal layer is a copper metal layer.

10. The RC circuit of claim 1 , wherein the semiconductor die includes active circuitry configured to drive an input signal through a first via into a first end of the metal layer resistor and to receive an output signal at a circuit node through a second via at a second end of the metal layer resistor.

11. The RC circuit of claim 10 , wherein the circuit node is connected to the first set of longitudinally-extending fingers through a third via, and wherein the active circuitry includes a ground node connected to the second set of longitudinally-extending fingers through a fourth via.

12. A resistor-capacitor (RC) circuit, comprising:

a metal layer resistor in a first metal layer adjacent a semiconductor die, the metal layer resistor including a plurality of longitudinally-extending leads each having a first width and separated by a first gap equaling the first width; and

a metal layer capacitor in the first metal layer including at least a pair of longitudinally-extending fingers interdigitated according to the first gap with at least at least one opposing longitudinally-extending finger, wherein each longitudinally-extending finger has the first width.

13. The RC circuit of claim 12 , wherein the metal layer resistor is coupled in series with the metal layer capacitor.

14. The RC circuit of claim 12 , wherein the metal layer resistor is coupled in parallel with the metal layer capacitor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2018
From: SONG, CHAO; HUANG, XUHAO; PEDRALI-NOY, MARZIO
To: QUALCOMM INCORPORATED
Reel/Frame 045303/0852 →
Continuity (1)
Related Publication 20190089030A1 · Mar 21, 2019
Cited By (1)
US 12,446,225