Bulk acoustic resonator and filter
A bulk acoustic resonator includes a substrate, a first electrode disposed above the substrate, a piezoelectric body disposed on the first electrode and including a plurality of piezoelectric layers each including aluminum nitride with a doping material, and a second electrode disposed on the piezoelectric body, where at least one of the piezoelectric layers is a compressive piezoelectric layer formed under compressive stress.
1. A bulk acoustic resonator comprising:
a substrate;
a first electrode disposed above the substrate;
a piezoelectric body disposed on the first electrode and including aluminum nitride with a doping material; and
a second electrode disposed on the piezoelectric body,
wherein the piezoelectric body comprises a first portion and a second portion, and
the first portion is closer to the first electrode than the second portion, and
a ratio (c/a) of a lattice parameter of the first portion in a c-axis direction to a lattice constant of the first portion in an a-axis direction is higher than a ratio (c/a) of a lattice parameter of the second portion in a c-axis direction to a lattice constant of the second portion in an a-axis direction.
2. The bulk acoustic resonator of claim 1 , further comprising an air cavity between the first electrode and the substrate.
3. The bulk acoustic resonator of claim 1 , wherein the doping material comprises one of scandium (Sc), erbium (Er), yttrium (Y), lanthanum (La), titanium (Ti), zirconium (Zr), and hafnium (Hf), or combinations thereof.
4. The bulk acoustic resonator of claim 1 , wherein a content of the doping material in each of the plurality of piezoelectric layers is 1 atom % to 20 atom %.
5. The bulk acoustic resonator of claim 1 , wherein the first portion has a c-axis lattice constant greater than a c-axis lattice constant of the second portion.
6. The bulk acoustic resonator of claim 1 , wherein the first electrode comprises one selected from gold (Au), titanium (Ti), tantalum (Ta), molybdenum (Mo), ruthenium (Ru), platinum (Pt), tungsten (W), aluminum (Al), nickel (Ni), and Iridium (Ir), or alloys thereof.
7. The bulk acoustic resonator of claim 1 , wherein the piezoelectric body comprises hexagonal closest packing (HCP) structures.
8. The bulk acoustic resonator of claim 1 , wherein the first electrode comprises body centered cubic (BCC) structures.
9. A bulk acoustic resonator comprising:
a substrate;
a first electrode disposed above the substrate;
a piezoelectric body disposed on the first electrode and including aluminum nitride with a doping material; and
a second electrode disposed on the piezoelectric body,
wherein a lattice constant of the first electrode in an a-axis direction is higher than 3.12 Å.
10. The bulk acoustic resonator of claim 9 , wherein the first electrode comprises one selected from gold (Au), titanium (Ti), tantalum (Ta), molybdenum (Mo), ruthenium (Ru), platinum (Pt), tungsten (W), aluminum (Al), nickel (Ni), and Iridium (Ir), or alloys thereof.
11. The bulk acoustic resonator of claim 9 , wherein the piezoelectric body comprises hexagonal closest packing (HCP) structures.
12. The bulk acoustic resonator of claim 9 , wherein the first electrode comprises body centered cubic (BCC) structures.
13. A filter comprising:
a plurality of film bulk acoustic resonators configured as signal filter, wherein at least one of the plurality of film bulk acoustic resonators is a bulk acoustic resonator of claim 1 .
14. A filter comprising:
a plurality of film bulk acoustic resonators configured as signal filter,
wherein at least one of the plurality of film bulk acoustic resonators is a bulk acoustic resonator of claim 9 .