IP Library › Granted Patent US 10,555,088
Granted Patent B2
US 10,555,088 · App. 15/816,332 · Granted Feb 4, 2020

MEMS microphone system having an electrode assembly

Inventors: Daniel Meisel (Pittsburgh, PA); Bernhard Gehl (Wannweil, DE); Yujie Zhang (Sunnyvale, CA); Andrew Doller (Sharpsburg, PA); Gokhan Hatipoglu (Pittsburgh, PA)
Assignees: Akustica, Inc.; Robert Bosch GmbH
H04R9/08H04R2201/003
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Quick Facts
Patent No.
US 10,555,088
App. No.
15/816,332
Granted
Feb 4, 2020
Kind
B2
Abstract

A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate capacitor element.

Claims (34)

1. A Microelectromechanical system (MEMS) microphone, comprising:

a base unit;

a driving system disposed on the base unit, the driving system comprising:

a carrier;

a wall structure mechanically coupled to the carrier and to the base unit; and

a plate counter electrode assembly mechanically coupled to the carrier, wherein

the wall structure and the carrier defining a sealed electrode region and the plate counter electrode assembly is disposed within the sealed electrode region and spaced apart from the wall structure, and

the plate counter electrode assembly comprises a first movable electrode member and a second movable electrode member, and the first and second movable electrode members are substantially made of a material having a conductivity.

2. The MEMS microphone of claim 1 wherein the carrier comprises a first and second diaphragm, and the first and second diaphragms are substantially made of an insulating material.

3. The MEMS microphone of claim 1 wherein the first and second movable electrode members are mechanically coupled to the first and second diaphragm.

4. The MEMS microphone of claim 2 wherein one or more of the diaphragms are substantially made of a material having a tensile residual stress.

5. The MEMS microphone of claim 1 wherein the plate counter electrode assembly comprises a material having a tensile residual stress.

6. The MEMS microphone of claim 3 further comprising one or more pillar formed within the driving system.

7. The MEMS microphone of claim 6 further comprising a leak hole formed through at least one of the pillar.

8. A driving system for a Microelectromechanical system (MEMS) microphone comprising:

a carrier comprising:

a first diaphragm;

a second diaphragm spaced apart from the first diaphragm; and

a gap formed between the first and second diaphragm;

a plate counter electrode assembly formed within the first and second diaphragms, the plate counter electrode assembly comprising:

a moving electrode member; and

at least two counter electrode members; and

a wall structure mechanically coupled to the two counter electrode members and to the first and second diaphragms and defining a sealed electrode region;

wherein the sealed electrode region has an encapsulated gas pressure and the plate counter electrode assembly is disposed within the sealed electrode region.

9. The driving system of claim 8 wherein the first diaphragm is substantially made of a material having a low conductivity and the second diaphragm is substantially made of an insulating material.

10. The driving system of claim 8 wherein the movable electrode member is substantially made of a material having a conductivity.

11. The driving system of claim 9 wherein one or more of the first and the second diaphragms are substantially made of a material having a tensile residual stress.

12. The driving system of claim 8 , the plate counter electrode assembly comprising a material having a tensile residual stress.

13. The driving system of claim 12 wherein the plate counter electrode assembly comprises at least two counter electrodes formed within the sealed electrode region.

14. The driving system of claim 8 further comprising a connecting member mechanically coupling the counter electrode assembly to the first and second diaphragms.

15. The driving system of claim 14 further comprising a leak hole formed through the connecting member.

16. The driving system of claim 11 further comprising one or more pillar formed within the driving system.

17. The driving system of claim 16 further comprising a leak hole.

18. The driving system of claim 17 wherein the leak hole is formed through at least one of the one or more pillar.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2018
From: MEISEL, DANIEL; GEHL, BERNHARD; ZHANG, YUJIE; DOLLER, ANDREW; HATIPOGLU, GOKHAN
To: AKUSTICA, INC.; ROBERT BOSCH GMBH
Reel/Frame 044965/0735 →
Continuity (2)
Provisional Application 62423966 · Nov 18, 2016
Related Publication 20180146296A1 · May 24, 2018
Cited By (1)
US 12,356,167