IP Library › Granted Patent US 10,555,413
Granted Patent B2
US 10,555,413 · App. 16/256,309 · Granted Feb 4, 2020

Inverter

Inventors: Kenichiro Ito (Aichi-ken, JP); Naohito Kanie (Aichi-ken, JP); Kazuyoshi Kontani (Aichi-ken, JP); Takuya Higashi (Aichi-ken, JP)
Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
H05K1/0203H02M7/003H05K1/181H05K7/2089H05K2201/10015H05K2201/10409
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,555,413
App. No.
16/256,309
Granted
Feb 4, 2020
Kind
B2
Abstract

An inverter includes a power substrate mounting power element groups arranged apart from each other, each power element group constituted by power elements arranged, a control substrate disposed apart from the power substrate in a plate thickness direction of the power substrate and mounting an electronic component for controlling the power elements, a capacitor substrate disposed between the power substrate and the control substrate and mounting capacitors, a release member fixed to the power substrate, and a spacer electrically connecting the power substrate and the capacitor substrate. The spacer includes a body portion disposed between two adjacent power element groups of the power element groups and a heat transfer portion disposed outside the power element groups in a direction in which the power elements are arranged and provided at a position not overlapping with the capacitors as viewed in a plate thickness direction of the capacitor substrate.

Claims (9)

1. An inverter comprising:

a power substrate mounting a plurality of power element groups arranged apart from each other, each of the plurality of power element groups constituted by a plurality of power elements arranged;

a control substrate disposed apart from the power substrate in a plate thickness direction of the power substrate and mounting an electronic component for controlling the plurality of power elements;

a capacitor substrate disposed between the power substrate and the control substrate and mounting a plurality of capacitors;

a heat release member fixed to the power substrate; and

a spacer electrically connecting the power substrate and the capacitor substrate,

wherein the spacer includes a body portion disposed between two adjacent power element groups of the plurality of power element groups and a heat transfer portion disposed outside the plurality of power element groups in a direction in which the plurality of power elements are arranged and disposed at a position not overlapping with the plurality of capacitors as viewed in a plate thickness direction of the capacitor substrate.

2. The inverter according to claim 1 , wherein the plurality of capacitors are disposed collectively closer to an end portion of the capacitor substrate than a center of the capacitor substrate in the direction in which the plurality of power elements are arranged, and wherein the heat transfer portion is disposed between the end portion of the capacitor substrate and the power substrate.

3. The inverter according to claim 1 , wherein the inverter includes a fixing screw fixing the spacer to the power substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2019
From: ITO, KENICHIRO; KANIE, NAOHITO; KONTANI, KAZUYOSHI; HIGASHI, TAKUYA
To: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
Reel/Frame 048123/0865 →
Priority Claims (1)
JP 2018-017445 · Feb 2, 2018 · national
Continuity (1)
Related Publication 20190246487A1 · Aug 8, 2019