IP Library › Granted Patent US 10,557,638
Granted Patent B2
US 10,557,638 · App. 15/818,832 · Granted Feb 11, 2020

Fan assembly for a packaged terminal air conditioner unit

Inventors: Robert William Jewell (Louisville, KY); Benjamin Justin Riggle (Louisville, KY)
Assignee: Haier US Appliance Solutions, Inc.
F24F1/027F24F13/24
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Quick Facts
Patent No.
US 10,557,638
App. No.
15/818,832
Granted
Feb 11, 2020
Kind
B2
Abstract

A packaged terminal air conditioner unit (PTAC) includes a vent aperture defined in a bulkhead of the PTAC and a fan assembly for urging a flow of make-up air through the vent aperture. The fan assembly includes a fan duct fluidly coupled to the bulkhead over the vent aperture and an auxiliary fan attached to the fan duct. An electronics assembly includes an electronics enclosure mounted to the fan duct and defining an electronics compartment having an opening for receiving power electronics for controlling the auxiliary fan. A top plate is attachable over the opening and a seal is positioned between the top plate and the electronics enclosure to substantially enclose and seal the electronics compartment.

Claims (32)

1. A packaged terminal air conditioner unit comprising:

a wall sleeve;

a bulkhead positioned within the wall sleeve and defining an indoor portion and an outdoor portion;

a vent aperture defined through the bulkhead for providing fluid communication between the indoor portion and the outdoor portion;

a fan duct attached to the bulkhead and defining a flow passage in fluid communication with the vent aperture; and

an electronics assembly comprising:

an electronics enclosure mounted to the fan duct and defining an electronics compartment having an opening;

a top plate attachable over the opening of the electronics enclosure to enclose the electronics compartment; and

a heat sink defined on an exterior surface of the top plate.

2. The packaged terminal air conditioner unit of claim 1 , wherein the electronics assembly comprises:

a seal positioned between the electronics enclosure and the top plate.

3. The packaged terminal air conditioner unit of claim 2 , wherein the seal is an O-ring formed from an elastomeric or rubber material.

4. The packaged terminal air conditioner unit of claim 2 , wherein the electronics enclosure defines a perimeter groove for at least partially receiving the seal.

5. The packaged terminal air conditioner unit of claim 4 , wherein the electronics enclosure defines a wire recess, the wire recess defining a recess groove for at least partially receiving the seal.

6. The packaged terminal air conditioner unit of claim 1 , wherein the top plate is mounted to the electronics enclosure using a plurality of mechanical fasteners.

7. The packaged terminal air conditioner unit of claim 1 , wherein the top plate of the electronics enclosure is constructed of a thermally conductive material.

8. The packaged terminal air conditioner unit of claim 7 , wherein the thermally conductive material is aluminum.

9. The packaged terminal air conditioner unit of claim 1 , wherein the electronics enclosure is formed from a thermoset plastic.

10. The packaged terminal air conditioner unit of claim 1 , wherein the electronics assembly is positioned within the outdoor portion.

11. The packaged terminal air conditioner unit of claim 1 , wherein the fan duct defines one or more mounting pads that protrude from the fan duct, and wherein the electronics enclosure defines one or more mounting recesses, the mounting recesses configured for receiving the mounting pads to mount the electronics enclosure to the fan duct.

12. The packaged terminal air conditioner unit of claim 11 , wherein at least one of the mounting pads is L-shaped such that it extends along a bottom side and wraps around a back side of the electronics enclosure.

13. The packaged terminal air conditioner unit of claim 11 , further comprising:

an adhesive joining the mounting pads and the mounting recesses to couple the electronics enclosure to the fan duct.

14. The packaged terminal air conditioner unit of claim 1 , wherein the electronics enclosure defines one or more mounting pads that protrude from the electronics enclosure, and wherein the fan duct defines one or more mounting recesses, the mounting recesses configured for receiving the mounting pads to mount the electronics enclosure to the fan duct.

15. An electronics assembly for a packaged terminal air conditioner unit, the packaged terminal air conditioner unit comprising a wall sleeve and a bulkhead positioned within the wall sleeve and defining a vent aperture and a fan duct mounted to the bulkhead over the vent aperture, the electronics assembly comprising:

an electronics enclosure mounted to the fan duct and defining an electronics compartment having an opening;

a top plate attachable over the opening of the electronics enclosure to enclose the electronics compartment; and

a heat sink defined on an exterior surface of the top plate.

16. The electronics assembly of claim 15 , wherein the electronics enclosure defines a perimeter groove and the electronics assembly comprises:

a seal positioned within the perimeter groove between the electronics enclosure and the top plate.

17. The electronics assembly of claim 15 , wherein the top plate of the electronics enclosure is constructed of a thermally conductive material and the electronics enclosure is formed from a thermoset plastic.

18. The electronics assembly of claim 15 , wherein the fan duct defines one or more mounting pads that protrude from the fan duct, and wherein the electronics enclosure defines one or more mounting recesses, the mounting recesses configured for receiving the mounting pads to mount the electronics enclosure to the fan duct.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2017
From: JEWELL, ROBERT WILLIAM; RIGGLE, BENJAMIN JUSTIN
To: HAIER US APPLIANCE SOLUTIONS, INC.
Reel/Frame 044187/0230 →
Continuity (1)
Related Publication 20190154277A1 · May 23, 2019
Cited By (1)
US 1,100,160