Spectrometry in integrated circuit using a photonic bandgap structure
An encapsulated package is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A set of broadband spectral sensors on the IC die are configured to generate a set of signals in response to electromagnetic energy received by the spectral sensors. A photonic filter structure within the encapsulation material is positioned adjacent the set of spectral sensors. The photonic filter structure is configured to pass a different frequency band of electromagnetic energy to each of the set of spectral sensors.
1. A An encapsulated package comprising:
an integrated circuit (IC) die;
sensors the IC die, the sensors configured to receive electromagnetic energy and to generate signals in response to the electromagnetic energy;
a filter structure including: a first region configured to pass a first band of the electromagnetic energy to the sensors or to block the first band of the electromagnetic energy from passing to the sensors; and a second region configured to pass a second band of the electromagnetic energy to the sensors or to block the second band of the electromagnetic energy from passing to the sensors; and
an encapsulation material encapsulating the IC die, the sensors and the filter structure, in which the filter structure includes a diffusion of particles within the encapsulation material, the encapsulation material having a first intrinsic property, and the particles having a second intrinsic property that is different from the first intrinsic property.
2. A package comprising:
an integrated circuit (IC) die;
sensors on the IC die, the sensors configured to receive electromagnetic energy and to generate signals in response to the electromagnetic energy;
a filter structure including: a first region configured to pass a first band of the electromagnetic energy to the sensors or to block the first band of the electromagnetic energy from passing to the sensors; and a second region configured to pass a second band of the electromagnetic energy to the sensors or to block the second band of the electromagnetic energy from passing to the sensors; and
an encapsulation material encapsulating the IC die, the sensors and the filter structure;
in which the filter structure is a photonic wave collimating structure or a multilayer photonic bandgap structure.
3. The package of claim 1 , in which the filter structure is a photonic wave collimating structure or a multilayer photonic bandgap structure.
4. The package of claim 1 , in which the filter structure: has an open path for a particular band of the electromagnetic energy to pass to a first one of the sensors; and is configured to block the particular band of the electromagnetic energy from passing to a second one of the sensors.
5. The package of claim 1 , in which the filter structure includes a matrix of periodically spaced nodes within the encapsulation material, the encapsulation material having the first intrinsic property, and the nodes having the second intrinsic property.
6. The package of claim 1 , in which the filter structure is a photonic resonant structure.
7. The package of claim 2 , in which the filter structure includes a diffusion of particles within the encapsulation material, the encapsulation material having a first intrinsic property, and the particles having a second intrinsic property that is different from the first intrinsic property.
8. A package comprising:
an integrated circuit (IC) die;
an emitter on the IC die, the emitter configured to emit electromagnetic energy;
a filter structure configured to pass a first band of the electromagnetic energy emitted by the emitter while blocking a second band of the electromagnetic energy emitted by the emitter; and
an encapsulation material encapsulating the IC die, the emitter and the filter structure, in which the filter structure includes a diffusion of particles within the encapsulation material, the encapsulation material having a first intrinsic property, and the particles having a second intrinsic property that is different from the first intrinsic property.
9. A package comprising:
an integrated circuit (IC) die;
an emitter on the IC die, the emitter configured to emit electromagnetic energy;
a filter structure configured to pass a first band of the electromagnetic energy emitted by the emitter while blocking a second band of the electromagnetic energy emitted by the emitter; and
an encapsulation material encapsulating the IC die, the emitter and the filter structure;
in which the filter structure is a photonic wave collimating structure or a multilayer photonic bandgap structure.
10. The package of claim 8 , in which the photonic filter structure is a photonic wave collimating structure or a multilayer photonic bandgap structure.
11. The package of claim 8 , in which the photonic filter structure includes a matrix of periodically spaced nodes within the encapsulation material, the encapsulation material having the first intrinsic property, and the nodes having have the second intrinsic property.
12. The encapsulated package of claim 9 , in which the photonic filter structure includes a diffusion of particles within the encapsulation material, wherein the encapsulation material having has-a first intrinsic property and the particles having nodes have a second intrinsic property that is different from the first intrinsic property.
13. The package of claim 8 , further comprising a photonic resonant structure between the emitter and the filter structure.
14. The package of claim 2 , in which the filter structure: has an open path for a particular band of the electromagnetic energy to pass to a first one of the sensors; and is configured to block the particular band of the electromagnetic energy from passing to a second one of the sensors.
15. The package of claim 2 , in which the filter structure includes a matrix of periodically spaced nodes within the encapsulation material, the encapsulation material having a first intrinsic property, and the nodes having a second intrinsic property that is different from the first intrinsic property.
16. The package of claim 2 , in which the filter structure is a photonic resonant structure.
17. The package of claim 9 , in which the filter structure includes a matrix of periodically spaced nodes within the encapsulation material, the encapsulation material having a first intrinsic property, and the nodes having a second intrinsic property that is different from the first intrinsic property.
18. The package of claim 9 , further comprising a photonic resonant structure between the emitter and the filter structure.