Resin composition and prepreg, resin sheet, laminate, and printed circuit board

1. A resin composition comprising

a compound represented by the following formula (a) or the following formula (b),

an alkenyl-substituted nadimide compound, and

a maleimide compound:

R—CH═CH—R′  (a)

wherein R represents a phenyl group which may have one or more of an alkyl group having 1 to 6 carbon atoms, an alkoxy group, a phenoxy group, a hydroxyl group or an amino group, a naphthyl group which may have one or more of an alkyl group having 1 to 6 carbon atoms, an alkoxy group, a phenoxy group, a hydroxyl group or an amino group, or a biphenyl group which may have one or more of an alkyl group having 1 to 6 carbon atoms, an alkoxy group, a phenoxy group, a hydroxyl group or an amino group, and R′ represents a methyl group, a phenyl group, a naphthyl group, a biphenyl group, or a benzyl group, wherein each of the phenyl group, the naphthyl group, the biphenyl group and the benzyl group may have one or more alkyl groups having 1 to 6 carbon atoms, and

wherein R a represents a group represented by the following formula (c), and a plurality of R b moieties each independently represent a methyl group, a phenyl group, a naphthyl group, a biphenyl group, or a benzyl group, wherein each of the phenyl group, the naphthyl group, the biphenyl group and the benzyl group may have one or more alkyl groups having 1 to 6 carbon atoms:

wherein each R c independently represents a methylene group, an isopropylidene group, or a substituent represented by —CO—, —O—, —S— or >SO 2 , and n represents an integer of 0 to 5,

wherein the compound represented by the formula (a) or the formula (b) comprises at least one compound selected from the group consisting of 1-propenylbenzene, 1-methoxy-4-(1-propenyl)benzene, 1,2-diphenylethene, 4-propenyl-phenol, and a compound represented by the following formula (b1):

and

wherein the resin composition comprises, as the alkenyl-substituted nadimide compound, a compound represented by the following formula (1):

wherein each R 1 independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and R 2 represents an alkylene group having 1 to 6 carbon atoms, a phenylene group, a biphenylene group, a naphthylene group, or a group represented by the following formula (2) or (3):

wherein R 3 represents a methylene group, an isopropylidene group, or a substituent represented by —CO—, —O—, —S—, or >SO 2 , and

wherein each R 4 independently represents an alkylene group having 1 to 4 carbon atoms, or a group represented by >SO 2 .

2. The resin composition according to claim 1 , wherein the resin composition comprises, as the alkenyl-substituted nadimide compound, a compound represented by the following formula (4) and/or (5):

3. The resin composition according to claim 1 , wherein the resin composition comprises, as the maleimide compound, at least one compound selected from the group consisting of bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, polytetramethylene oxide-bis(4-maleimidobenzoate), and a maleimide compound represented by the following formula (6):

wherein each R 5 independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more.

4. The resin composition according to claim 1 , further comprising a cyanic acid ester compound.

5. The resin composition according to claim 4 , wherein the resin composition comprises, as the cyanic acid ester compound, a compound represented by the following formula (7) and/or (8):

wherein each R 6 independently represents a hydrogen atom or a methyl group, and n 2 represents an integer of 1 or more, and

wherein each R 7 independently represents a hydrogen atom or a methyl group, and n 3 represents an integer of 1 or more.

6. The resin composition according to claim 1 , further comprising an inorganic filler.

7. The resin composition according to claim 6 , wherein the resin composition comprises, as the inorganic filler, at least one selected from the group consisting of silica, alumina, aluminum nitride, and boron nitride.

8. A printed circuit board comprising an insulating layer and a conductor layer formed on the surface of the insulating layer, wherein the insulating layer comprises the resin composition according to claim 1 .

9. A metal foil-clad laminate comprising:

at least one selected from the group consisting of

i) a prepreg comprising a base material and the resin composition according to claim 1 , the base material being impregnated or coated with the resin composition and

ii) resin sheet comprising a support and the resin composition according to claim 1 , the support being coated with the resin composition; and

a metal foil disposed on one side or both sides of the at least one selected from the group consisting of the prepreg and the resin sheet,

wherein the metal foil-clad laminate comprises a cured product of the resin composition contained in the at least one selected from the group consisting of the prepreg and the resin sheet.