Conductive adhesive composition
A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180° C. or higher. More preferably, the reaction initiation temperature is 200° C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.
1. A conductive adhesive composition, which comprises
(A) a thermosetting resin;
(C) a filler that contains a metal element; and
(D) at least one catalyst or curing agent,
wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180° C. or higher,
wherein (A) the thermosetting resin is a bismaleimide resin having the following structure:
wherein X 1 to X 4 are each independently H or an alkyl group with 1 to 6 carbons, and Q is a “C36” structure of the following formula containing a cyclohexane-base core and four long “arms” attached thereto:
2. The conductive adhesive composition according to claim 1 , wherein the reaction initiation temperature for the (A) thermosetting resin and (D) at least one catalyst or curing agent is 200° C. or higher.
3. The conductive adhesive composition according to claim 1 , which further comprises (B) a flux.
4. The conductive adhesive composition according to claim 3 , wherein the average particle size of the (B) flux is 30 μm or smaller.
5. The conductive adhesive composition according to claim 3 , wherein the (B) flux contains at least a carboxylic acid with a molecular weight of 300 or less.
6. The conductive adhesive composition according to claim 1 , wherein the (A) thermosetting resin amounts to 0.5 to 20.0 percent by mass of the total mass of the solid content of the conductive adhesive composition.
7. The conductive adhesive composition according to claim 1 , wherein the (C) filler contains a conductive particle C1, which contains at least one metal element R1, wherein R1 is at least one metal element selected from the group consisting of Cu, Ag, Au, Pt, Ir, Os, Pd, Ru, Ga, In, Al, Re, Zn, Ni, Sn, Bi and Sb.
8. The conductive adhesive composition according to claim 7 , wherein the (C) filler is a mixture that further contains a conductive particle C2, which contains a metal element R2 other than the metal element R1.
9. The conductive adhesive composition according to claim 8 , wherein the melting point of a new alloy formed by the reaction between conductive particle C1 and conductive particle C2 is lower than the melting point of R1.
10. The conductive adhesive composition according to claim 1 , wherein the (C) filler amounts to 75 percent by mass or more of the total mass of the solid content of the conductive adhesive composition.
11. The conductive adhesive composition according to claim 1 , wherein the (C) filler is one that is capable of forming a sintered compact.
12. The conductive adhesive composition according to claim 1 , which further comprises a (E) polymer component.
13. The conductive adhesive composition according to claim 12 , wherein the compounding ratio of the (E) polymer component is 5 to 50 percent by mass of the solid content of the conductive adhesive composition, excluding the mass of the (C) filler.
14. An adhesive film, which comprises the conductive adhesive composition according to claim 1 coated on to a substrate.
15. An adhesive film with dicing tape, which comprises the adhesive film of claim 14 laminated on to the dicing tape.
16. A conductive adhesive composition, which comprises
(A) a thermosetting resin;
(C) a filler that contains a metal element; and
(D) at least one catalyst or curing agent,
wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180° C. or higher,
wherein (A) the thermosetting resin is a bismaleimide resin having the following structure, wherein n is 1 to 20: