Cooling systems for cooling electronic components

1. A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions configured to cause a processor to control a set of mechanical pumps such that the set of mechanical pumps performs a method comprising:

pumping a first fluid through an evaporator thermally coupled to a first set of electronic components while circulating within a first cooling loop such that the first fluid is vaporized, at least partially, using operational heat generated by the first set of electronic components as it passes through the evaporator;

pumping the first fluid through a preheating section disposed in the first cooling loop between an output of a condenser and an input of the evaporator;

pumping a second fluid through a cold plate thermally coupled to a second set of electronic components while circulating within a second cooling loop such that the second fluid is heated using operational heat generated by the second set of electronic components as it passes through the cold plate such that there is an increase in a temperature of the second fluid;

pumping a first portion of the second fluid as output from the cold plate toward an input of a heat exchanger via a first route disposed in the second cooling loop, the first route thermally coupled to the preheating section such that heat transfer from the first portion to the preheating section as the first portion passes through the first route causes an increase in a temperature of the first fluid as the first fluid passes through the preheating section; and

pumping a second portion of the second fluid as output from the cold plate toward the input of the heat exchanger via a second route disposed in the second cooling loop, the second route arranged such that the first portion passes closer to the preheating section of the first loop than the second portion passes to the preheating section.

2. The computer program product of claim 1 , wherein the program instructions are further configured to cause the processor to:

determine that the temperature of the first fluid as output by the preheating section is above a target temperature range; and

cause, in response to the determining and via the set of mechanical pumps, the second portion of the second fluid being pumped through the second route to increase in volumetric flow rate and the first portion of the second fluid being pumped through the first route to decrease in volumetric flow rate.

3. The computer program product of claim 2 , wherein the causing the second portion of the second fluid to increase in volumetric flow rate and the first portion of the second fluid to decrease in volumetric flow rate comprises:

causing an adjustment in an adjustable valve disposed in the second cooling loop between the output of the cold plate and the input of the heat exchanger, the adjustable valve configured to apportion the second fluid between the first route and the second route.

4. The computer program product of claim 2 , wherein the program instructions are further configured to cause the processor to:

monitor, via a temperature sensor electrically coupled to the processor, the temperature of the first fluid as output from the preheating section.

5. The computer program product of claim 1 , wherein the pumping the first fluid through the preheating section is performed by a first subset of the set of mechanical pumps that are disposed in the first cooling loop, and wherein the pumping the first and second portions of the second fluid as output from the cold plate is performed by a second subset of the set of mechanical pumps that are disposed in the second cooling loop.

6. The computer program product of claim 1 , wherein the program instructions are further configured to cause the processor to:

cause the condenser to condense the vaporized first fluid output from the evaporator as the vaporized first fluid passes through the condenser while circulating through the first loop toward the evaporator; and

cause the heat exchanger to cool the second fluid as output from the cold plate as the second fluid passes through the heat exchanger while circulating through the second loop toward the cold plate.

7. The computer program product of claim 1 , wherein the first cooling loop is a mechanically-pumped, two-phase closed cooling loop configured for cooling the first set electronic components, and wherein the second cooling loop is a mechanically-pumped, single-phase closed cooling loop configured for cooling the second set electronic components.

8. The computer program product of claim 1 , wherein the first set of electronic components includes a processor chip, and wherein the evaporator comprises a plurality micro-channels embedded within the processor chip such that operational heat from the processor chip causes flow boiling of the first fluid passing through the plurality of micro-channels.

9. The computer program product of claim 1 , wherein the first set of electronic components includes a processor chip, and wherein the evaporator comprises a second cold plate attached to the processor chip such that operational heat from the processor chip causes flow boiling of the first fluid passing through the second cold plate.

10. A method comprising:

vaporizing, at least partially, a first fluid, as it passes through an evaporator thermally coupled to a first set of electronic components while circulating within a first cooling loop, using operational heat generated by the first set of electronic components;

pumping the first fluid through a preheating section disposed in the first cooling loop between an output of a condenser and an input of the evaporator;

heating a second fluid, as it passes through a cold plate thermally coupled to a second set of electronic components while circulating within a second cooling loop, using operational heat generated by the second set of electronic components such that there is an increase in a temperature of the second fluid;

pumping a first portion of the second fluid as output from the cold plate toward an input of a heat exchanger via a first route disposed in the second cooling loop, the first route thermally coupled to the preheating section such that heat transfer from the first portion to the preheating section as the first portion passes through the first route causes an increase in a temperature of the first fluid as the first fluid passes through the preheating section; and

pumping a second portion of the second fluid as output from the cold plate toward the input of the heat exchanger via a second route disposed in the second cooling loop, the second route arranged such that the first portion passes closer to the preheating section of the first loop than the second portion passes to the preheating section.

11. The method of claim 10 further comprising:

determining, by a controller, that the temperature of the first fluid as output by the preheating section is above a target temperature range; and

causing, in response to the determining and by the controller, the second portion of the second fluid being pumped through the second route to increase in volumetric flow rate and the first portion of the second fluid being pumped through the first route to decrease in volumetric flow rate.

12. The method of claim 11 , wherein the causing the second portion of the second fluid to increase in volumetric flow rate and the first portion of the second fluid to decrease in volumetric flow rate comprises:

adjusting an adjustable valve disposed in the second cooling loop between the output of the cold plate and the input of the heat exchanger, the adjustable valve configured to apportion the second fluid between the first route and the second route.

13. The method of claim 11 further comprising:

monitoring, by a temperature sensor electrically coupled to the controller, the temperature of the first fluid as output from the preheating section.

14. The method of claim 10 , wherein the pumping the first fluid through the preheating section is performed by a first set of mechanical pumps disposed in the first cooling loop, and wherein the pumping the first and second portions of the second fluid as output from the cold plate is performed by a second set of mechanical pumps disposed in the second cooling loop.

15. The method of claim 10 , further comprising:

condensing, by the condenser, the vaporized first fluid output from the evaporator as the vaporized first fluid passes through the condenser while circulating through the first loop toward the evaporator; and

cooling, by the heat exchanger, the second fluid as output from the cold plate as the second fluid passes through the heat exchanger while circulating through the second loop toward the cold plate.

16. The method of claim 10 , wherein the first cooling loop is a mechanically-pumped, two-phase closed cooling loop configured for cooling the first set electronic components, and wherein the second cooling loop is a mechanically-pumped, single-phase closed cooling loop configured for cooling the second set electronic components.

17. The method of claim 10 , wherein the first set of electronic components includes a processor chip, and wherein the evaporator comprises a plurality micro-channels embedded within the processor chip such that operational heat from the processor chip causes flow boiling of the first fluid passing through the plurality of micro-channels.

18. The method of claim 10 , wherein the first set of electronic components includes a processor chip, and wherein the evaporator comprises a second cold plate attached to the processor chip such that operational heat from the processor chip causes flow boiling of the first fluid passing through the second cold plate.

19. The method of claim 10 , wherein the second set of electronic components comprises a dual in-line memory module.

20. The method of claim 10 , wherein the first set of electronic components are high heat flux electronic components, and wherein the second set of electronic components are low heat flux electronic components.