Semiconductor structure
A semiconductor structure is provided. The semiconductor structure includes a substrate, at least one semiconductor device, a through-substrate via (TSV), and a shield structure. The substrate has a front side surface and a back side surface. The semiconductor device is disposed on the front side surface. The TSV is disposed in the substrate. The TSV is exposed by the front side surface and the back side surface, and the TSV is electrically connected to the semiconductor device. The shield structure is disposed in the substrate and surrounds the TSV. The shield structure is exposed by the front side surface, the shield structure is electrically isolated from the TSV, and the shield structure and the TSV have bottom ends at the same height.
1. A semiconductor structure, comprising:
a substrate having a front side surface and a back side surface;
at least one semiconductor device disposed on the front side surface;
a through-substrate via (TSV) disposed in the substrate, wherein the TSV is exposed by the front side surface and the back side surface, and the TSV is electrically connected to the semiconductor device;
a shield structure disposed in the substrate and surrounding the TSV, wherein the substrate is substantially absent between the TSV and the shield structure; and
a first dielectric layer covering a bottom surface of the shield structure, wherein the substrate is in contact with a bottom surface of the first dielectric layer.
2. The semiconductor structure of claim 1 , further comprising:
a second dielectric layer disposed on the front side surface;
a first circuit layer disposed in the second dielectric layer, wherein the first circuit layer is electrically connected to the TSV; and
a second circuit layer disposed in the second dielectric layer, wherein the second circuit layer is electrically connected to the shield structure.
3. The semiconductor structure of claim 2 , further comprising:
a first pad electrically connected to the first circuit layer; and
a second pad electrically connected to the second circuit layer.
4. The semiconductor structure of claim 2 , wherein the second dielectric layer, the first circuit layer, the second circuit layer, and the semiconductor device form a first redistribution layer.
5. The semiconductor structure of claim 2 , wherein the shield structure has a connecting portion electrically connecting the second circuit layer.
6. The semiconductor structure of claim 1 , wherein the shield structure is covered by the back side surface.
7. The semiconductor structure of claim 1 , wherein a height of the TSV is greater than a height of the shield structure.
8. The semiconductor structure of claim 1 , wherein the shield structure is a metal layer.
9. The semiconductor structure of claim 1 , further comprising:
a second redistribution layer disposed on the back side surface and electrically connected to the TSV.
10. The semiconductor structure of claim 9 , further comprising:
a bump disposed on a side of the second redistribution layer opposite to the substrate.
11. The semiconductor structure of claim 9 , wherein the second redistribution layer comprises:
a third dielectric layer; and
a third circuit layer disposed in the third dielectric layer and electrically connected to the TSV.
12. The semiconductor structure of claim 1 , wherein the TSV is made of copper.
13. The semiconductor structure of claim 1 , wherein the TSV and the shield structure are made of a same material.
14. The semiconductor structure of claim 1 , wherein the first dielectric layer covers a sidewall of the shield structure.
15. The semiconductor structure of claim 1 , wherein the TSV and the shield structure have top surfaces substantially at a same height.
16. The semiconductor structure of claim 1 , wherein the TSV and the shield structure have bottom surfaces substantially at different heights.