Semiconductor device manufacturing method including doping from a diffused layer
The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The manufacturing method includes: providing a substrate; forming a source and a drain that are at least partially located in the substrate; forming a diffused layer on a surface of at least one of the source or the drain, where a conductivity type of the diffused layer is the same conductivity type as the source and the drain, and a doping density of a dopant contained in the diffused layer is separately greater than doping densities of dopants contained in the source and the drain; and performing an annealing processing after the diffused layer is formed. The present disclosure can increase a doping density at a surface of a source and/or a drain, helping to reduce a contact resistance, thereby improving performance of a device.
1. A method for manufacturing a semiconductor device, comprising:
providing a substrate;
forming a source and a drain that are at least partially located in the substrate;
forming a diffused layer on a surface of at least one of the source or the drain, wherein a conductivity type of the diffused layer is the same conductivity type as the source and the drain, and a doping density of a dopant contained in the diffused layer is separately greater than doping densities of dopants contained in the source and the drain;
forming a barrier layer on the diffused layer; and
after forming the barrier layer, performing an annealing processing to enable the dopant in the diffused layer to diffuse towards the surface of the at least one of the source or the drain.
2. The method according to claim 1 , wherein:
the conductivity type of the source and the drain is N-typed, and the material of the diffused layer comprises a phosphorus-doped silicon dioxide; or
the conductivity type of the source and the drain is P-typed, and the material of the diffused layer comprises a boron-doped silicon dioxide.
3. The method according to claim 1 , wherein the annealing processing comprises:
a first annealing processing; and
a second annealing processing after the first annealing processing is performed.
4. The method according to claim 3 , wherein:
the first annealing processing is a spike annealing; and
the second annealing processing is a laser annealing.
5. The method according to claim 4 , wherein:
an annealing temperature of the spike annealing is between 900° C. and 1050° C.; and
an annealing temperature of the laser annealing is between 1100° C. and 1300° C.
6. The method according to claim 1 , further comprising:
forming, on the barrier layer, an interlayer dielectric layer covering the source and the drain; and
forming a source contact and a drain contact that pass through the interlayer dielectric layer, wherein the source contact is connected to the source, and the drain contact is connected to the drain.
7. The method according to claim 1 , wherein:
the substrate comprises: a semiconductor layer and a semiconductor fin on the semiconductor layer; and
in the step of forming the source and the drain, the source and the drain are at least partially formed in the semiconductor fin, separately.
8. A method for manufacturing a semiconductor device, comprising:
providing a substrate, wherein the substrate comprises a first semiconductor area and a second semiconductor area that are isolated, and a conductivity type of the first semiconductor area is opposite to a conductivity type of the second semiconductor area;
forming a first source and a first drain that are at least partially located in the first semiconductor area;
forming a first diffused layer on surfaces of the first source and the first drain, wherein a conductivity type of the first diffused layer is the same conductivity type as a conductivity type of the first source and the first drain, and a doping density of a dopant contained in the first diffused layer is separately greater than doping densities of dopants contained in the first source and the first drain;
forming a first barrier layer on the first diffused layer;
forming a second source and a second drain that are at least partially located in the second semiconductor area; and
after forming the barrier layer, performing an annealing processing to enable the dopant in the diffused layer to diffuse towards the surfaces of the first source and the first drain.
9. The method according to claim 8 , wherein before the annealing processing is performed, the method further comprises:
forming a second diffused layer on surfaces of the second source and the second drain, wherein a conductivity type of the second diffused layer is the same as a conductivity type of the second source and the second drain, and a doping density of a dopant contained in the second diffused layer is separately greater than doping densities of dopants contained in the second source and the second drain; and
forming a second barrier layer on the second diffused layer.
10. The method according to claim 9 , wherein:
the conductivity type of the first source and the first drain is P-typed, and the material of the first diffused layer comprises a boron-doped silicon dioxide; and
the conductivity type of the second source and the second drain is N-typed, and the material of the second diffused layer comprises a phosphorus-doped silicon dioxide.
11. The method according to claim 9 , wherein the annealing processing comprises:
a first annealing processing; and
a second annealing processing after the first annealing processing is performed.
12. The method according to claim 11 , wherein:
the first annealing processing is a spike annealing; and
the second annealing processing is a laser annealing.
13. The method according to claim 12 , wherein:
an annealing temperature of the spike annealing is between 900° C. and 1050° C.; and
an annealing temperature of the laser annealing is between 1100° C. and 1300° C.
14. The method according to claim 9 , wherein:
in the step of forming the second diffused layer, the second diffused layer is further formed on the first barrier layer above the first source and the first drain.
15. The method according to claim 9 , further comprising:
forming, on the second barrier layer, an interlayer dielectric layer covering the first source, the first drain, the second source, and the second drain; and
forming a first source contact, a first drain contact, a second source contact, and a second drain contact that pass through the interlayer dielectric layer, wherein the first source contact is connected to the first source, the first drain contact is connected to the first drain, the second source contact is connected to the second source, and the second drain contact is connected to the second drain.
16. The method according to claim 9 , wherein:
in the step of providing a substrate, the first semiconductor area is a first semiconductor fin, the second semiconductor area is a second semiconductor fin, and the substrate further comprises a semiconductor layer, wherein both the first semiconductor fin and the second semiconductor fin are on the semiconductor layer;
in the step of forming the first source and the first drain, the first source and the first drain are at least partially formed in the first semiconductor fin, separately; and
in the step of forming the second source and the second drain, the second source and the second drain are at least partially formed in the second semiconductor fin, separately.