IP Library Granted Patent US 10,574,802
Granted Patent B2
US 10,574,802 · App. 16/244,495 · Granted Feb 25, 2020

Housing assembly, electronic assembly module, and electronic device with same

Inventors: Chueh-Chuan Chen (New Taipei, TW); Yi-Chieh Miao (New Taipei, TW); Meng-Jer Huang (New Taipei, TW)
Assignee: Chiun Mai Communication Systems, Inc.
H04M1/0264G06F1/1686H04M1/0277H04N5/2252H04N5/2257H04N5/2258H04N5/23258H04N2007/145
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Quick Facts
Patent No.
US 10,574,802
App. No.
16/244,495
Granted
Feb 25, 2020
Kind
B2
Abstract

A housing assembly able to provide precise and adjustable mounting of a camera module. The holder is on the first housing and a first groove is formed on a surface of the holder away from the first housing. An inclined surface is formed on an end of the holder which corresponding to the first side wall. The second housing is mounted on the holder. A protrusion is formed on a surface of the second housing toward the holder. The protrusion protrudes from the surface of the second housing. A second groove is formed on the protrusion. One end of the holder formed with the inclined surface is received it the second groove. The inclined surface abuts against the second side wall to adjust the alignment relationship between the holder and the second housing. An electronic assembly module and an electronic device with the electronic assembly module is also provided.

Claims (29)

1. A housing assembly comprising:

a first housing;

a holder positioned on the first housing, wherein a first groove is formed on a surface of the holder which is away from the first housing, the first groove comprises a first bottom wall and a first side wall, an inclined surface is formed on an end of the holder which corresponding to the first side wall; and

a second housing mounted on the holder, wherein a protrusion is formed on a surface of the second housing toward the holder, the protrusion protrudes from the surface of the second housing, a second groove is formed on the protrusion, the second groove comprises a second side wall, the end of the holder formed with the inclined surface is received in the second groove, the inclined surface abuts against the second side wall to adjust an alignment relationship between the holder and the second housing;

wherein the holder is provided with at least two mating sections, the first housing is provided with at least two limiting posts, the at least two mating sections match the at least two limiting posts, and the at least two limiting posts are correspondingly disposed in the at least two mating sections to mount the holder on the first housing, a gap is formed on each of the at least two mating sections and receives one of the at least two limiting posts, a size of the gap is greater than a size of the matched limiting post, the holder is movable relative to the at least two limiting posts.

2. The housing assembly of claim 1 , wherein the alignment relationship between the holder and the second housing is an alignment relationship in a two-dimensional direction.

3. The housing assembly of claim 1 , wherein the second housing is a back cover.

4. An electronic assembly module comprising:

an electronic assembly; and

a housing assembly comprising:

a first housing;

a holder positioned on the first housing, wherein the holder comprises a first accommodating space configured for receiving the electronic assembly, a first groove is formed on a surface of the holder which is away from the first housing, the first groove comprises a first bottom wall and a first side wall, an inclined surface is formed on an end of the holder which corresponding to the first side wall; and

a second housing mounted on the holder, wherein the second housing comprises a second accommodation space configured for receiving the holder, a protrusion is formed on a surface of the second housing toward the holder, the protrusion protrudes from the surface of the second housing, a second groove is formed on the protrusion, the second groove comprises a second side wall, the end of the holder formed with the inclined surface is received in the second groove, the inclined surface abuts against the second side wall to adjust an alignment relationship between the holder and the second housing;

wherein the holder is provided with at least two mating sections, the first housing is provided with at least two limiting posts, the at least two mating sections match the at least two limiting posts, and the at least two limiting posts are correspondingly disposed in the at least two mating sections to mount the holder on the first housing, a gap is formed on each of the at least two mating sections and receives one of the at least two limiting posts, a size of the gap is greater than a size of the matched limiting post, the holder is movable relative to the at least two limiting posts.

5. The electronic assembly module of claim 4 , wherein the alignment relationship between the holder and the second housing is an alignment relationship in a two-dimensional direction.

6. The electronic assembly module of claim 4 , wherein the second housing is a back cover.

7. The electronic assembly module of claim 4 , wherein the electronic assembly is one of a camera assembly, a flash and a proximity sensor.

8. The electronic assembly module of claim 4 , wherein the holder comprises a top surface, an bottom surface and a peripheral wall, the top surface and the bottom surface are on two opposite sides of the holder, the peripheral wall is connected between the top surface and the bottom surface, the top surface is recessed downwardly toward the bottom surface to form the first accommodating space, the second housing comprises an outer surface and an inner surface, the outer surface and the inner surface are on two opposite sides of the second housing, the inner surface is recessed toward the outer surface to form a second accommodating space.

9. The electronic assembly module of claim 8 , wherein a non-right angle is formed between the top surface and the inclined surface.

10. An electronic device comprising:

a circuit board; and

an electronic assembly module comprising:

an electronic assembly; and

a housing assembly comprising:

a first housing;

a holder positioned on the first housing, wherein the circuit board is disposed on the holder and electrically connected to the electronic assembly, the holder comprises a first accommodating space configured for receiving the electronic assembly, a first groove is formed on a surface of the holder which is away from the first housing, the first groove comprises a first bottom wall and a first side wall, an inclined surface is formed on an end of the holder which corresponding to the first side wall; and

a second housing mounted on the holder, wherein the second housing comprise a second accommodation space, the second accommodation space is configured for receiving the holder, a protrusion is formed on a surface of the second housing toward the holder, the protrusion protrudes from the surface of the second housing, a second groove is formed on the protrusion, the second groove comprises a second side wall, the end of the holder formed with the inclined surface is received in the second groove, the inclined surface abuts against the second side wall to adjust an alignment relationship between the holder and the second housing;

wherein the holder is provided with at least two mating sections, the first housing is provided with at least two limiting posts, the at least two mating sections match the at least two limiting posts, and the at least two limiting posts are correspondingly disposed in the at least two mating sections to mount the holder on the first housing, a gap is formed on each of the at least two mating sections and receives one of the at least two limiting posts, a size of the gap is greater than a size of the matched limiting post, the holder is movable relative to the at least two limiting posts.

11. The electronic device of claim 10 , wherein the circuit board is disposed on the holder, and the circuit board is configured for mating with the first housing to position the holder to the first housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2019
From: CHEN, CHUEH-CHUAN; MIAO, YI-CHIEH; HUANG, MENG-JER
To: CHIUN MAI COMMUNICATION SYSTEMS, INC.
Reel/Frame 048044/0297 →
Priority Claims (1)
CN 2018 1 0032475 · Jan 12, 2018 · national
Continuity (1)
Related Publication 20190238668A1 · Aug 1, 2019
Cited By (2)
US 12,244,916 US 12,619,129