Electronic component

1. An electronic component comprising:

an element body having a pair of end surfaces which face each other and four side surfaces which connect the pair of end surfaces and formed of a semiconductor ceramic;

a thin film layer disposed to cover the pair of end surfaces and the four side surfaces and having an electrical insulation property;

a first external electrode and a second external electrode disposed on a side of each of the pair of end surfaces; and

an internal conductor disposed in the element body,

wherein the thin film layer is formed along a surface shape of each of the pair of end surfaces and the four side surfaces,

each of the first external electrode and the second external electrode has a first electrode layer disposed on the thin film layer and electrically connected to the internal conductor, a second electrode layer disposed to cover the first electrode layer, a first plating layer disposed to cover the second electrode layer, and a second plating layer disposed to cover the first plating layer,

a thermal conductivity of the second electrode layer is lower than a thermal conductivity of the first electrode layer; and

a thermal conductivity of the first plating layer and the second plating layer is lower than the thermal conductivity of the first electrode layer.

2. The electronic component according to claim 1 ,

wherein a thickness of the thin film layer disposed on the four side surfaces is greater than a thickness of the thin film layer disposed on the pair of end surfaces.

3. The electronic component according to claim 1 ,

wherein the thin film layer has a thickness of 50 nm or more and 300 nm or less.