Spot heater and device for cleaning wafer using the same
A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
1. A heater comprising:
a heating source configured to irradiate laser light onto a wafer, to heat the wafer;
a support arm supporting the heating source;
a cover unit isolating the heating source from outside, and comprising a transparent material;
a purge unit configured to remove foreign materials from the heating source, and comprising a vent configured to spray a purge gas to the heating source, the vent being disposed within an inner wall of the cover unit; and
a heater chuck on which the wafer is mounted, the heater chuck being configured to heat a bottom surface of the wafer,
wherein the heater chuck comprises:
a top plate supporting the wafer;
a ring heater configured to heat the top plate from underneath the top plate;
a spin chuck assembly accommodating the ring heater; and
a spin motor assembly positioned under the spin chuck assembly and configured to rotate the spin chuck assembly and the top plate,
wherein the spin chuck assembly comprises a first hole,
wherein the spin motor assembly comprises a second hole aligned with the first hole, and
wherein the heater chuck further comprises a fixing shaft coupled to the ring heater and passing through the first hole and the second hole.
2. The heater of claim 1 , wherein the laser light penetrates the cover unit.
3. The heater of claim 1 , further comprising a filter interposed between the heating source and the wafer, and configured to be an iris.
4. The heater of claim 3 , wherein the filter is further configured to filter the laser light, to adjust a size of a spot of the wafer that is heated.
5. The heater of claim 1 , wherein the purge unit further comprises a cable configured to supply the purge gas.
6. The heater of claim 1 , wherein the purge gas comprises nitrogen gas.
7. A device for cleaning a wafer, the device comprising:
a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer, for etching;
a heater,
wherein the heater comprises:
a heating source configured to heat the wafer;
a support arm supporting the heating source;
a cover unit isolating the heating source from outside, and comprising a transparent material; and
a purge unit configured to remove foreign materials from the heating source, and comprising a vent configured to spray a purge gas to the heating source, the vent being disposed within an inner wall of the cover unit; and
a heater chuck on which the wafer is mounted, the heater chuck being configured to heat a bottom surface of the wafer,
wherein the heater chuck comprises:
a top plate supporting the wafer;
a ring heater configured to heat the top plate from underneath the top plate;
a spin chuck assembly accommodating the ring heater; and
a spin motor assembly positioned under the spin chuck assembly and configured to rotate the spin chuck assembly and the top plate,
wherein the spin chuck assembly comprises a first hole,
wherein the spin motor assembly comprises a second hole aligned with the first hole, and
wherein the heater chuck further comprises a fixing shaft coupled to the ring heater and passing through the first hole and the second hole.
8. The device of claim 7 , wherein the heating source is further configured to irradiate laser light onto the wafer, to heat the wafer.
9. The device of claim 8 , wherein the laser light has a wavelength in a near infrared (NIR) region.
10. The device of claim 8 , wherein the laser light penetrates the cover unit.
11. The device of claim 7 , wherein the purge gas comprises nitrogen gas.
12. The heater of claim 7 , wherein the fixing shaft and the ring heater are fixedly attached while the spin motor assembly and the spin chuck assembly rotate.