Method of manufacturing ceramic electronic component, and ceramic electronic component
A method of manufacturing a ceramic electronic component including a main body including a first principal surface and a second principal surface opposite to each other, and a first external electrode and a second external electrode provided on a portion of a surface of the main body, includes providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with a first principal surface of the laminated block, obtaining a chip by cutting the laminated block including the recesses, and obtaining the main body by firing the chip.
1. A ceramic electronic component comprising:
a main body including a first principal surface and a second principal surface opposite to each other;
a first external electrode and a second external electrode provided on a portion of a surface of the main body; and
a plurality of recesses extending in one direction along the first principal surface; wherein
all of the plurality of recesses extend in the one direction along the first principal surface; and
the first principal surface includes a covered portion that is covered by one of the first and second external electrodes and includes the plurality of recesses.
2. The ceramic electronic component according to claim 1 , wherein the plurality of recesses are provided at least entirely on an exposed portion of the first principal surface.
3. The ceramic electronic component according to claim 1 , wherein the plurality of recesses are provided at least entirely in the first principal surface.
4. The ceramic electronic component according to claim 1 , wherein an extending direction of the plurality of recesses is different from a direction parallel or substantially parallel to a length direction of the main body and is different from a direction perpendicular or substantially perpendicular to the length direction of the main body.
5. The ceramic electronic component according to claim 1 , wherein:
the first external electrode and the second external electrode respectively provided on the first principal surface and the second principal surface each include conductive thin films directly provided on the first principal surface and the second principal surface, and plated layers directly provided on the conductive thin films; and
the plated layer has a maximum thickness larger than a maximum thickness of the conductive thin films.
6. The ceramic electronic component according to claim 1 , wherein:
the main body includes a plurality of laminated ceramic layers and inner conductor layers; and
the plurality of inner conductor layers include a plurality of first inner conductor layers exposed at least on a first end surface of the main body and connected with the first external electrode provided on the first end surface, and a plurality of second inner conductor layers exposed at least on a second end surface of the main body and connected with the second external electrode provided on the second end surface.
7. The ceramic electronic component according to claim 1 , wherein:
a plurality of recesses extending in one direction are further provided in the second principal surface; and
an extending direction of the recesses in the second principal surface is different from an extending direction of the recesses in the first principal surface.
8. The ceramic electronic component according to claim 1 , wherein the main body has a rectangular or substantially rectangular parallelepiped shape.