Through-hole electrode substrate
A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.
1. A through-hole electrode substrate comprising:
a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planar view is smallest among a plurality of areas of the through-hole in a planar view;
wherein a shape of a side wall of the through-hole between the first aperture and the second aperture is a consecutive curve shape,
the through-hole has a maximum aperture part between the first aperture and the second aperture, and
the maximum aperture part is larger than the second aperture in a planar view.
2. The through-hole electrode substrate according to claim 1 , wherein at least a part of the side wall of the through-hole in a cross-sectional view includes a curve having an inflection point.
3. The through-hole electrode substrate according to claim 1 , wherein a conductive film is arranged inside of the through-hole.
4. The through-hole electrode substrate according to claim 3 , wherein the conductive film is also arranged on the first surface and on the second surface.
5. The through-hole electrode substrate according to claim 1 , wherein an insulation film and a conductive film are arranged inside of the through-hole in sequence from a side wall side of the through-hole.
6. The through-hole electrode substrate according to claim 5 , wherein the conductive film is also arranged on the first surface and the second surface.
7. The through-hole electrode substrate according to claim 1 , further comprising a filler arranged within the through-hole.
8. The through-hole electrode substrate according to claim 7 , wherein the filler is a conductive material.
9. The through-hole electrode substrate according to claim 7 , wherein the filler is an insulation material.
10. The through-hole electrode substrate according to claim 1 , wherein the substrate has insulation properties.
11. The through-hole electrode substrate according to claim 1 , wherein the substrate has conductive properties.
12. A semiconductor device comprising the through-hole electrode substrate according to claim 1 , an LSI substrate and a semiconductor chip.
13. A through-hole electrode substrate comprising:
a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, and including a first part and a second part, the second part having a larger area in a planar view than the first part and the first aperture;
wherein a shape of a side wall of the through-hole between the first aperture and the second aperture is a consecutive curve shape,
the through-hole has a maximum aperture part between the first aperture and the second aperture, and
the maximum aperture part is larger than the second aperture in a planar view.
14. The through-hole electrode substrate according to claim 13 , wherein at least a part of the side wall of the through-hole in a cross-sectional view includes a curve having an inflection point.
15. The through-hole electrode substrate according to claim 13 , wherein a conductive film is arranged inside of the through-hole.
16. The through-hole electrode substrate according to claim 15 , wherein the conductive film is also arranged on the first surface and on the second surface.
17. The through-hole electrode substrate according to claim 13 , wherein an insulation film and a conductive film are arranged inside of the through-hole in sequence from a side wall side of the through-hole.
18. The through-hole electrode substrate according to claim 17 , wherein the conductive film is also arranged on the first surface and the second surface.
19. The through-hole electrode substrate according to claim 13 , further comprising a filler arranged within the through-hole.
20. The through-hole electrode substrate according to claim 19 , wherein the filler is a conductive material.