Resin molding method and resin molding apparatus
A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.
1. A resin molding apparatus that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the apparatus comprising:
a molding die including a pot into which a first resin tablet and a second resin tablet formed of thermosetting resin is injected;
a plunger slide controller that controls a plunger sliding in the pot;
a clamping die that pushes the workpiece against the molding die;
a clamping die slide controller that slides the clamping die;
a first tablet heating part that heats the first resin tablet to a first temperature;
a second tablet heating part that heats the second resin tablet to a second temperature higher than the first temperature;
a transport mechanism that transports the first resin tablet, the second resin tablet, and the workpiece to the molding die; and
a resin mold controller that controls the plunger slide controller, the clamping die slide controller, and the transport mechanism, wherein:
the molding die heats the first resin tablet and the second resin tablet injected into the pot,
the resin mold controller instructs the transport mechanism to:
inject the first resin tablet and the second resin tablet into the pot in such a way that the second resin tablet is positioned closer to the workpiece than the first resin tablet is in the pot, and
provide the workpiece in the molding die after the first resin tablet and the second resin tablet are injected into the pot,
the resin mold controller instructs the clamping die slide controller to push the workpiece against the molding die after the workpiece is provided in the molding die, and
the resin mold controller instructs the plunger slide controller to:
push out the first resin tablet and the second resin tablet in such a way that the second resin tablet is injected into the insertion hole first by the plunger while heating the first resin tablet and the second resin tablet within the pot, wherein the heating is controlled such that the second resin tablet is softened sufficiently for injection into the insertion hole and, at the start of the injecting of the second resin tablet into the insertion hole, the first resin tablet is not softened sufficiently for injection into the insertion hole, and
after completion of the injection of the second resin tablet into the insertion hole, inject, into the insertion hole, the first resin tablet, which has been continuously heated during the injecting of the second resin tablet into the insertion hole such that the first resin tablet is softened sufficiently for injection into the insertion hole, in such a way that the process of injecting the first resin tablet becomes continuous with the process of injecting the second resin tablet.