IP Library Granted Patent US 10,584,983
Granted Patent B2
US 10,584,983 · App. 15/518,749 · Granted Mar 10, 2020

Cover structure of tactile sensor and tactile sensor

Inventors: Yuki Murota (Kanagawa, JP); Hiroshi Umebayashi (Kanagawa, JP); Toru Uda (Kanagawa, JP); Hidekazu Yoshihara (Ibaraki, JP); Taisuke Kimura (Ibaraki, JP); Keizo Toyama (Ibaraki, JP)
Assignees: NOK CORPORATION; NIPPON MEKTRON, LTD.
G01D11/245B25J13/084B25J15/0033G01L1/26
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Quick Facts
Patent No.
US 10,584,983
App. No.
15/518,749
Granted
Mar 10, 2020
Kind
B2
Abstract

The present invention aims at providing a cover structure of a tactile sensor and a tactile sensor that can secure sufficient adhesion between a sensor body and a covering layer without providing an adhesive layer and have no possibility of causing a sensor to make detection error due to the covering layer formed thereon. A cover structure of a tactile sensor according to the present invention includes a sensor body 2 and a covering layer 3 made of elastic body molded on the sensor body 2 . The covering layer 3 includes at least two layers of an outer layer 32 disposed as the outermost layer and an inner layer 31 disposed to come in contact with the sensor body 2 and having a higher adhesiveness and a lower hardness than those of the outer layer 32 , and is integrally molded with the sensor body 2 by the cast molding. It is preferable that the sensor body 2 be disposed on the top surface of the base 4 , the covering layer 3 cover over the sensor body 2 and the base 4 , and the inner layer 31 do not cover the bottom surface of the base 4.

Claims (10)

1. A cover structure of a tactile sensor comprising:

a sensor body; and

a covering layer made of elastic body molded on the sensor body, wherein

the covering layer includes an inner layer disposed to come in contact with the sensor body and an outer layer disposed on an outermost surface of the inner layer, the inner layer having a higher adhesiveness and a lower hardness than those of the outer layer, and the covering layer is integrally molded with the sensor body by a cast molding, wherein

the sensor body is disposed on a top surface of a base, the outer layer covers at least a portion of a bottom surface of the base, the bottom surface facing away from the top surface, and the inner layer does not cover the bottom surface of the base, wherein

the sensor body comprises a flexible print circuit-board and a sensor element, and wherein

the flexible print circuit-board includes first and second surfaces facing opposite directions from one another, and wherein the print circuit-board is disposed such that the first surface contacts the top surface of the base and the second surface contacts the sensor element.

2. The cover structure of a tactile sensor according to claim 1 , wherein the inner layer has a Shore A hardness of 0 to 40 degrees, and the outer layer has a Shore A hardness of 20 to 90 degrees.

3. The cover structure of a tactile sensor according to claim 1 wherein the inner layer has a thickness of 1.0 mm to 20.0 mm, and the outer layer has a thickness of 0.2 mm to 2.0 mm.

4. A tactile sensor comprising the cover structure of a tactile sensor according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2017
From: MUROTA, YUKI; UMEBAYASHI, HIROSHI; UDA, TORU; YOSHIHARA, HIDEKAZU; KIMURA, TAISUKE; TOYAMA, KEIZO
To: NOK CORPORATION; NIPPON MEKTRON, LTD.
Reel/Frame 041987/0787 →
Priority Claims (1)
JP 2015-028922 · Feb 17, 2015 · national
Continuity (1)
Related Publication 20170343394A1 · Nov 30, 2017