IP Library › Granted Patent US 10,585,315
Granted Patent B2
US 10,585,315 · App. 15/735,369 · Granted Mar 10, 2020

Display panel and display apparatus thereof

Inventor: Yu-Jen Chen (Chongqing, CN)
Assignees: HKC CORPORATION LIMITED; CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
G02F1/13452G02F1/1368G02F1/133308G02F1/133514G02F1/133528G02F1/133608H01L27/124
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,585,315
App. No.
15/735,369
Granted
Mar 10, 2020
Kind
B2
Abstract

The present invention relates to a display panel and display apparatus thereof. The display panel comprises: a first substrate having an outer surface and an inner surface, wherein a bonding region is formed on a peripheral region of the outer surface, a plurality of through micro-holes are formed on the bonding region, a conductive material is filled in the through micro-holes, and an electrode layer is formed on the inner surface; and a flexible printed circuit (FPC) film is electrically connecting the bonding region and electrode layer on the inner surface of the first substrate by the conductive material.

Claims (29)

1. A display apparatus, comprising:

a backlight module; and

a display panel, comprising:

a first substrate having an outer surface and an inner surface, wherein a bonding region is formed on a peripheral region of the outer surface, a plurality of through micro-holes are formed on the bonding region, a conductive material is filled in the through micro-holes, and an electrode layer is formed on the inner surface; and

a flexible printed circuit (FPC) film is electrically connected to the bonding region, and is electrically connected to the electrode layer on the inner surface of the first substrate by the conductive material; and

a front bezel, a sealing glue bezel, and a backplane for receiving the backlight module; the front bezel set against a second polarizer of the display panel, the sealing glue bezel set against the first substrate of the display panel, and the backplane combining with the sealing glue bezel to form a receiving space for accommodating the backlight module,

wherein a relying surface is protruded horizontally from a horizontal surface of the sealing glue bezel, the relying surface is higher than the horizontal surface and adheres to the peripheral region of the bonding region of the first substrate, and a flexible printed circuit (FPC) film bonding space is defined between the horizontal surface and the bonding region on the outer surface of the first substrate.

2. The display apparatus according to claim 1 , wherein the backlight module is a direct-lighting type backlight module.

3. A display apparatus, comprising:

a backlight module; and

a display panel, comprising:

a first substrate having an outer surface and an inner surface, wherein a bonding region is formed on a peripheral region of the outer surface, a plurality of through micro-holes are formed on the bonding region, a conductive material is filled in the through micro-holes, and an electrode layer is formed on the inner surface; and

a flexible printed circuit (FPC) film is electrically connected to the bonding region, and is electrically connected to the electrode layer on the inner surface of the first substrate by the conductive material; and

a front bezel, a sealing glue bezel, and a backplane for receiving the backlight module; the front bezel set against a second polarizer of the display panel, the sealing glue bezel set against the first polarizer of the display panel, and the backplane combining with the sealing glue bezel to form a receiving space for accommodating the backlight module,

wherein a horizontal surface of the sealing glue bezel adheres to the first polarizer, and a flexible printed circuit (FPC) film bonding space is defined between the horizontal surface and the outer surface of the first substrate.

4. The display apparatus according to claim 3 , wherein the first substrate is a thin film transistor (TFT) substrate.

5. The display apparatus according to claim 4 , wherein a width of the first substrate and a width of the second substrate are the same.

6. The display apparatus according to claim 3 , wherein the second substrate is a color filter (CF) substrate.

7. The display apparatus according to claim 3 , wherein the conductive material includes a metal material.

8. The display apparatus according to claim 3 , wherein the through micro-holes are formed by a Laser-reaming process.

9. A display apparatus, comprising:

a backlight module;

a display panel, comprising:

a thin-film transistor (TFT) substrate having an outer surface and an inner surface, a bonding region formed on the outer surface, a plurality of through micro-holes formed on the bonding region, a copper material filled in the through micro-holes, and an electrode layer formed on the inner surface;

a flexible printed circuit (FPC) film electrically connected to the bonding region, and electrically connected to the electrode layer on the inner surface of the thin-film transistor (TFT) substrate by the copper material; and

a color filter (CF) substrate set opposite to the thin film transistor (TFT) substrate, wherein a width of the thin film transistor (TFT) substrate and a width of the color filter (CF) substrate are the same;

a front bezel, the front bezel set against a second polarizer of the display panel;

a sealing glue bezel, the sealing glue bezel set against athe first polarizer of the display panel and a horizontal surface of the sealing glue bezel adhering to the first polarizer, and a flexible printed circuit (FPC) film bonding space defined between the horizontal surface and the outer surface of the thin film transistor (TFT) substrate; and

a backplane, the backplane combining with the sealing glue bezel to form a receiving space for accommodating the backlight module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2017
From: CHEN, YU-JEN
To: HKC CORPORATION LIMITED; CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 044370/0709 →
Priority Claims (1)
CN 2017 1 0144393 · Mar 10, 2017 · national
Continuity (1)
Related Publication 20190011754A1 · Jan 10, 2019