Multi-level air gap formation in dual-damascene structure
An upper layer is formed in a first interlayer dielectric (ILD) layer. The upper layer comprises a plurality of metal interconnects and one or more upper layer air gaps positioned between adjacent metal interconnects. A lower layer is formed in the first ILD layer. The lower layer comprises one or more vias, and one or more lower air gaps positioned between adjacent vias. The upper layer and the lower layer are formed in accordance with a dual-damascene process.
1. A method for forming a semiconductor structure comprising steps of:
forming an upper layer in a first interlayer dielectric (ILD) layer, wherein forming the upper layer in the first ILD layer comprises:
forming a plurality of metal interconnects; and
forming one or more upper layer air gaps positioned between adjacent metal interconnects;
forming a lower layer in the first ILD layer, wherein forming the lower layer in the first layer comprises forming one or more lower layer air gaps positioned between adjacent vias formed within the lower layer;
forming a second ILD layer prior to forming the first ILD layer;
embedding one or more components in the second ILD layer, wherein the one or more components comprise:
one or more gate regions,
one or more caps,
one or more source/drain contact regions, and
one or more barrier lines,
wherein each cap is positioned in physical contact with a respective gate region.
2. The method of claim 1 , wherein a given one of the one or more lower layer air gaps is comprised of ambient air.
3. The method of claim 1 , wherein a given one of the one or more lower layer air gaps is comprised of an inert gas.
4. The method of claim 3 , wherein the inert gas comprises one of nitrogen and helium.
5. The method of claim 1 , wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions.
6. The method of claim 5 , wherein the one or more dielectric regions are comprised of a low-k dielectric material.
7. The method of claim 1 , wherein the second ILD layer is formed via one of chemical vapor deposition, atomic layer deposition, plasma enhanced chemical vapor deposition, and spin coating.
8. The method of claim 7 , wherein the one or more components comprise one or more contacts.
9. The method of claim 1 , wherein the second ILD layer is comprised of a low-k dielectric material.
10. The method of claim 1 , wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions, and wherein the one or more dielectric regions are positioned in physical contact with the one or more caps, respectively.
11. A method for forming a semiconductor structure comprising steps of:
forming an upper layer in a first interlayer dielectric (ILD) layer, wherein forming the upper layer in the first layer comprises:
forming a plurality of metal interconnects; and
forming one or more upper layer air gaps positioned between adjacent metal interconnects; and
forming a lower layer in the first ILD layer, wherein forming the lower layer in the first ILD layer comprises forming one or more lower layer air gaps positioned between adjacent vias formed within the lower layer;
forming a second ILD layer prior to forming the first ILD layer;
embedding one or more components in the second ILD layer, wherein the one or more components comprise:
one or more gate regions,
one or more caps, and
one or more barrier lines,
wherein each cap is positioned in physical contact with a respective gate region.
12. The method of claim 11 , wherein a given one of the one or more lower layer air gaps is comprised of ambient air.
13. The method of claim 11 , wherein a given one of the one or more lower layer air gaps is comprised of an inert gas.
14. The method of claim 13 , wherein the inert gas comprises one of nitrogen and helium.
15. The method of claim 11 , wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions.
16. A method for forming a semiconductor structure comprising steps of:
forming an upper layer in a first interlayer dielectric (ILD) layer, wherein forming the upper layer in the first ILD layer comprises:
forming a plurality of metal interconnects; and
forming one or more upper layer air gaps positioned between adjacent metal interconnects; and
forming a lower layer in the first ILD layer, wherein forming the lower layer in the first ILD layer comprises forming one or more lower layer air gaps positioned between adjacent vias formed within the lower layer, wherein the second ILD layer is formed via one of chemical vapor deposition, atomic layer deposition, plasma enhanced chemical vapor deposition, and spin coating;
forming a second ILD layer prior to forming the first MD layer;
embedding one or more components in the second ILD layer, wherein the one or more components comprise:
one or more gate regions,
one or more caps,
one or more source/drain contact regions and
one or more barrier lines,
wherein each cap is positioned in physical contact with a respective gate region.
17. The method of claim 16 , wherein a given one of the one or more lower layer air gaps is comprised of ambient air.
18. The method of claim 16 , wherein a given one of the one or more lower layer air gaps is comprised of an inert gas.
19. The method of claim 18 , wherein the inert gas comprises one of nitrogen and helium.
20. The method of claim 16 , wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions.