IC die, ultrasound probe, ultrasonic diagnostic system and method
An integrated circuit (IC) die ( 100 ) is disclosed having a major surface delimited by at least one edge ( 102 ) of the IC die, said major surface carrying a plurality of electrically conductive contact plates ( 130 ) extending from said major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion ( 132 ) delimited by the at least one edge for mating with an electrically conductive further contact surface portion ( 230 ) on at least one further edge ( 220 ) of a body ( 200 ), said at least one further edge delimiting a cavity for receiving the IC die. An ultrasound probe including such an IC die and a method of providing such an IC die with contacts are also disclosed.
1. An ultrasound probe comprising a tip including:
an integrated circuit die having a major surface delimited by at least one edge of the IC die, said major surface comprising an ultrasound sensing area and carrying a plurality of electrically conductive contact plates for suspending the IC die in a cavity; and
a body having at least one further edge delimiting the cavity comprising the IC die, said at least one further edge comprising a plurality of electrically conductive first further contact surface portion,
wherein the contact plates extending from said die major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion delimited by the at least one edge for mating with the electrically conductive further contact surface portion on the further edge of the body, said at least one further edge delimiting the cavity for receiving the IC die; and wherein each electrically conductive first further contact surface is conductively coupled to the contact surface portion of one of said contact plates.
2. The ultrasound probe of claim 1 , wherein the ultrasound sensing area is defined by a plurality of capacitive micro-machined ultrasonic transducer elements.
3. The ultrasound probe of claim 1 , wherein said major surface comprises a plurality of bond pads, and wherein each electrically conductive contact plate extends from one of said bond pads.
4. The ultrasound probe of claim 1 , wherein the electrically conductive contact plates are made of a metal or metal alloy.
5. The ultrasound probe of claim 4 , wherein the metal or metal alloy is diamagnetic.
6. The ultrasound probe of claim 1 , wherein the contact plates have a thickness of at least 20 micron.
7. The ultrasound probe of claim 1 , wherein each electrically conductive first further contact surface is conductively coupled to the contact surface portion of one of said contact plates by a conductive solder or a conductive glue.
8. The ultrasound probe of claim 1 , wherein said body comprises a flex foil including a plurality of conductive tracks on the flex foil, wherein each conductive track includes one of said first further contact surfaces.
9. The ultrasound probe of claim 1 , wherein:
said tip further houses signal processing circuitry on a printed circuit board carrying a plurality of board contacts conductively coupled to signal processing circuitry inputs;
the flex foil comprises an annular section housing the IC die and an arcuate section extending from the annular section, said arcuate section comprising a pair of opposing edge portions each comprising a plurality of electrically conductive second further contact surfaces, each electrically conductive second further contact surface forming part of one of said conductive tracks; and
each electrically conductive second further contact surface is conductively coupled to one of said board contacts.
10. An ultrasonic diagnostic system including the ultrasound probe of claim 1 .