Structure comprising an inductor and resistor
A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.
1. A chip part comprising:
a semiconductor substrate made of a semiconductor material;
a coil which includes a coil conductive member embedded in a coil formation trench formed, in plan view, in a spiral shape in the semiconductor substrate, the coil formation trench extending from a surface of the semiconductor substrate into a depth of the semiconductor substrate;
a resistor portion which includes a resistor portion conductive member film formed above the surface of the semiconductor substrate outside the coil formation trench; and
a capacitor which includes:
a first internal electrode formed with a first capacitor conductive member embedded in a first internal electrode formation trench formed in the semiconductor substrate, and
a second internal electrode formed with a second capacitor conductive member embedded in a second internal electrode formation trench formed, in plan view, apart from the first internal electrode formation trench in the semiconductor substrate.
2. The chip part according to claim 1 , wherein
the resistor portion conductive member film includes a resistive film formed above the surface of the semiconductor substrate, and a plurality of conductor films formed apart on the resistive film, and
a portion of the resistive film that is exposed between the conductor films adjacent to each other forms one resistor body.
3. The chip part according to claim 2 , wherein
the chip part further comprises a first electrode and a second electrode which are formed apart from each other above the surface of the semiconductor substrate,
a plurality of the resistor bodies having an equal resistance value are aligned in a matrix above the surface of the semiconductor substrate, and
the resistor portion conductive member film further includes a fuse portion which can be blown so as to electrically connect at least one of the plurality of the resistor bodies to the first electrode and the second electrode or so as to electrically separate the at least one of the plurality of the resistor bodies from the first electrode and the second electrode.
4. The chip part according to claim 1 , wherein
the chip part further comprises a first electrode and a second electrode which are formed apart from each other above the surface of the semiconductor substrate, and
the coil and the resistor portion are aligned in a direction in which the first electrode and the second electrode are opposite to each other.
5. The chip part according to claim 1 , wherein
the chip part further comprises a first electrode and a second electrode which are formed apart from each other above the surface of the semiconductor substrate, and
the coil and the resistor portion are aligned in a direction intersecting a direction in which the first electrode and the second electrode are opposite to each other.
6. The chip part according to claim 1 , wherein
the chip part further comprises a first electrode and a second electrode which are formed apart from each other above the surface of the semiconductor substrate, and
the coil, the resistor portion and the capacitor are aligned in a direction in which the first electrode and the second electrode are opposite to each other.
7. The chip part according to claim 6 , wherein the coil, the resistor portion and the capacitor are connected in series.
8. The chip part according to claim 6 , wherein the coil, the resistor portion and the capacitor are aligned in a direction intersecting a direction in which the first electrode and the second electrode are opposite to each other.
9. The chip part according to claim 8 , wherein
the coil includes one end which can be electrically connected to the first electrode and the other end which can be electrically connected to the second electrode,
the resistor portion includes one end which can be electrically connected to the first electrode and the other end which can be electrically connected to the second electrode,
the capacitor includes one end which can be electrically connected to the first electrode and the other end which can be electrically connected to the second electrode, and
the chip part includes:
a first internal connection portion which connects, above the surface of the semiconductor substrate, at least two of the one ends of the coil, the resistor portion and the capacitor and which is electrically connected to the first electrode and
a second internal connection portion which connects, above the surface of the semiconductor substrate, at least two of the other ends of the coil, the resistor portion and the capacitor and which is electrically connected to the second electrode.
10. The chip part according to claim 1 , further comprising:
an insulating film which is formed on the semiconductor substrate so as to cover the coil,
wherein the resistor portion is formed on the insulating film.
11. The chip part according to claim 10 , wherein the insulating film includes a flat surface.
12. The chip part according to claim 10 , wherein the insulating film includes a USG film or an SOG film.
13. The chip part according to claim 10 , wherein the insulating film has a thickness of 8000 to 15000 angstroms.
14. The chip part according to claim 10 , wherein at least a part of the resistor portion is formed, in plan view, in a region overlapping a region where the coil is formed.
15. A chip part comprising:
a semiconductor substrate made of a semiconductor material;
a coil which includes a coil conductive member embedded in a coil formation trench formed, in plan view, in a spiral shape in the semiconductor substrate, the coil formation trench extending from a surface of the semiconductor substrate into a depth of the semiconductor substrate; and
a resistor portion which includes a resistor portion conductive member film formed above the surface of the semiconductor substrate outside the coil formation trench,
wherein
the resistor portion conductive member film includes a resistive film formed above the surface of the semiconductor substrate, and a plurality of conductor films formed apart on the resistive film,
a portion of the resistive film that is exposed between the conductor films adjacent to each other forms one resistor body
the chip part further comprises a first electrode and a second electrode which are formed apart from each other above the surface of the semiconductor substrate,
a plurality of the resistor bodies having an equal resistance value are aligned in a matrix above the surface of the semiconductor substrate, and
the resistor portion conductive member film further includes a fuse portion which can be blown so as to electrically connect at least one of the plurality of the resistor bodies to the first electrode and the second electrode or so as to electrically separate the at least one of the plurality of the resistor bodies from the first electrode and the second electrode.