IP Library Granted Patent US 10,593,464
Granted Patent B2
US 10,593,464 · App. 15/649,465 · Granted Mar 17, 2020

Semiconductor element

Inventors: Hsiao-Tsung Yen (Hsinchu, TW); Cheng-Wei Luo (Hsinchu, TW); Yuh-Sheng Jean (Hsinchu County, TW); Ta-Hsun Yeh (Hsinchu, TW)
Assignee: REALTEK SEMICONDUCTOR CORPORATION
H01F27/2804H01F27/29H01L23/5227H01L28/10H01F2027/2809
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Quick Facts
Patent No.
US 10,593,464
App. No.
15/649,465
Granted
Mar 17, 2020
Kind
B2
Abstract

A semiconductor element includes a first coil substantially located at a first plane; a second coil substantially located at the first plane; a connecting section that connects the first coil and the second coil; a third coil substantially located at a second plane different from the first plane; and a fourth coil substantially located at the second plane. The third coil and the first coil are connected through a through structure, and the fourth coil and the second coil are connected through a through structure. The third coil and the fourth are not directly connected.

Claims (25)

1. A semiconductor element, comprising:

a first spiral coil formed with a first end and a second end and comprising a first outer turn and a first inner turn that is located in a region surrounded by said first outer turn;

a second spiral coil, wherein said second spiral coil and said first spiral coil are located in substantially a same metal layer, and said second spiral comprises a second outer turn and a second inner turn that is located in a region surrounded by said second outer turn;

a connecting section, connecting said first spiral coil and said second spiral coil; and

a guide segment section, with one end connected to said first end and said second end;

wherein, a region surrounded by said second spiral coil and at least one of said guide segment section and said connecting section partially overlap;

wherein, said connecting section and a region surrounded by said second spiral coil partially overlap, and said connecting section connects said first inner turn and said second inner turn.

2. The semiconductor element of claim 1 , wherein said first spiral coil comprises:

an outer turn; and

an inner turn, located in a region surrounded by said outer turn;

wherein, said guide segment section and a region surrounded by said second spiral coil partially overlap, and said first end and said second end are located at said inner turn.

3. The semiconductor element of claim 2 , wherein said guide segment section further partially overlaps a region surrounded by said first spiral coil.

4. The semiconductor element of claim 1 , wherein

said first spiral coil comprises:

a first outer turn; and

a first inner turn, located in a region surrounded by said first outer turn; and

said second spiral coil comprises:

a second outer turn; and

a second inner turn, located in a region surrounded by said second outer turn;

wherein, said connecting section and a region surrounded by said second spiral coil partially overlap, and said connecting section connects said first outer turn and said second outer turn.

5. The semiconductor element of claim 4 , wherein said guide segment section further partially overlaps a region surrounded by said first spiral coil.

6. The semiconductor element of claim 4 , wherein said guide segment section and a region surrounded by said first inner turn do not overlap.

7. The semiconductor element of claim 1 , wherein said guide segment section further partially overlaps a region surrounded by said first spiral coil.

8. The semiconductor element of claim 1 , wherein said guide segment section and a region surrounded by said first inner turn do not overlap.

9. The semiconductor element of claim 1 , wherein said first end and said second end are located at said first outer turn.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2017
From: YEN, HSIAO-TSUNG; LUO, CHENG-WEI; JEAN, YUH-SHENG; YEH, TA-HSUN
To: REALTEK SEMICONDUCTOR CORPORATION
Reel/Frame 043002/0635 →
Priority Claims (1)
TW 105124973 A · Aug 5, 2016 · national
Continuity (1)
Related Publication 20180040412A1 · Feb 8, 2018