Semiconductor image sensor module and method of manufacturing the same
A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.
1. An imaging device, comprising:
a first substrate including:
a pixel array unit including a first plurality of pixels arranged in a first direction, the first plurality of pixels including a first pixel configured to output a first analog signal, and a second plurality of pixels arranged in the first direction, the second plurality of pixels including a second pixel configured to output a second analog signal,
a driver circuit configured to drive the first plurality of pixels and the second plurality of pixels, the drive circuit being adjacent to the pixel array unit in a second direction that is different from the first direction, and
a plurality of signal lines extending along the first direction, the plurality of signal lines including a first signal line coupled to the first plurality of pixels and a second signal line coupled to the second plurality of pixels; and
a second substrate including:
a first analog to digital converter configured to receive the first analog signal via the first signal line, and
a second analog to digital converter configured to receive the second analog signal via the second signal line,
wherein the first substrate is laminated to the second substrate such that a part of the pixel array unit, a part of the driver circuit, and a part of the plurality of signal lines are adjacent to a part of the first analog to digital converter and a part of the second analog to digital converter in a third direction that is different from the first direction and the second direction.
2. The imaging device according to claim 1 , wherein the first analog to digital converter is configured to receive the first analog signal via a connection portion.
3. The imaging device according to claim 1 , the first signal line coupled to the first analog to digital converter via a first connection portion and the second signal line coupled to the second analog to digital converter via a second connection portion.
4. The imaging device according to claim 2 , wherein the connection portion is disposed between the first substrate and the second substrate.
5. The imaging device according to claim 1 , wherein the first analog to digital converter includes a first comparator and a first counter, and the second analog to digital converter includes a second comparator and a second counter.
6. The imaging device according to claim 5 , further comprising a reference signal generation circuit configured to output a reference signal to the first comparator and the second comparator.
7. The imaging device according to claim 6 , wherein the first comparator is configured to compare the first analog signal and the reference signal, and the second comparator is configured to compare the second analog signal and the reference signal.
8. The imaging device according to claim 1 , wherein the second substrate includes a reference signal generation circuit configured to output a reference signal.
9. The imaging device according to claim 1 , wherein the first analog to digital converter is adjacent to the second analog to digital converter in the second direction.
10. The imaging device according to claim 1 , wherein the first plurality of pixels is adjacent to the second plurality of pixels in the second direction.
11. The imaging device according to claim 1 , further comprising a timing control circuit configured to output a control signal to the driver circuit.
12. The imaging device according to claim 1 , wherein the first pixel includes a first photoelectric conversion element, a first transfer transistor, a first reset transistor, a first amplifier transistor, and a first select transistor.
13. The imaging device according to claim 12 , wherein the second pixel includes a second photoelectric conversion element, a second transfer transistor, a second reset transistor, a second amplifier transistor, and a second select transistor.
14. The imaging device according to claim 1 , wherein the first pixel includes a plurality of first photoelectric conversion elements that share a first reset transistor, a first amplifier transistor, and a first select transistor.
15. The imaging device according to claim 14 , wherein the second pixel includes a plurality of second photoelectric conversion elements that share a second reset transistor, a second amplifier transistor, and a second select transistor.
16. An imaging device, comprising:
a first substrate including:
a pixel array unit including a first plurality of pixels arranged in a first direction, the first plurality of pixels including a first pixel configured to output a first analog signal, and a second plurality of pixels arranged in the first direction, the second plurality of pixels including a second pixel configured to output a second analog signal,
a driver circuit configured to drive the first plurality of pixels and the second plurality of pixels, the drive circuit being adjacent to the pixel array unit in a second direction that is different from the first direction, and
a plurality of signal lines extending along the first direction, the plurality of signal lines including a first signal line coupled to the first plurality of pixels and a second signal line coupled to the second plurality of pixels; and
a second substrate including:
a first electronic processing circuit configured to receive the first analog signal via the first signal line, and
a second electronic processing circuit configured to receive the second analog signal via the second signal line,
wherein the first substrate is laminated to the second substrate such that a part of the pixel array unit, a part of the driver circuit, and a part of the plurality of signal lines are adjacent to a part of the first electronic processing circuit and a part of the second electronic processing circuit in a third direction that is different from the first direction and the second direction.
17. The imaging device according to claim 16 , wherein the first electronic processing circuit includes a portion of a first analog to digital converter.
18. The imaging device according to claim 17 , wherein the second electronic processing circuit includes a portion of a second analog to digital converter.
19. The imaging device according to claim 18 , wherein the first analog to digital converter includes a first comparator and a first counter, and the second analog to digital converter includes a second comparator and a second counter.
20. The imaging device according to claim 19 , further comprising a reference signal generation circuit configured to output a reference signal to the first comparator and the second comparator.
21. The imaging device according to claim 16 , wherein the first analog to digital converter is configured to receive the first analog signal via a connection portion.
22. The imaging device according to claim 21 , wherein the connection portion is disposed between the first substrate and the second substrate.
23. The imaging device according to claim 16 , wherein the second substrate includes a reference signal generation circuit configured to output a reference signal.
24. The imaging device according to claim 16 , wherein the first electronic processing circuit is adjacent to the second electronic processing circuit in the second direction.
25. The imaging device according to claim 16 , wherein the first plurality of pixels is adjacent to the second plurality of pixels in the second direction.
26. The imaging device according to claim 16 , further comprising a timing control circuit configured to output a control signal to the driver circuit.
27. The imaging device according to claim 16 , wherein the first pixel includes a first photoelectric conversion element, a first transfer transistor, a first reset transistor, a first amplifier transistor, and a first select transistor, and the second pixel includes a second photoelectric conversion element, a second transfer transistor, a second reset transistor, a second amplifier transistor, and a second select transistor.
28. The imaging device according to claim 16 , wherein the first pixel includes a plurality of first photoelectric conversion elements that share a first reset transistor, a first amplifier transistor, and a first select transistor.
29. The imaging device according to claim 28 , wherein the second pixel includes a plurality of second photoelectric conversion elements that share a second reset transistor, a second amplifier transistor, and a second select transistor.
30. The imaging device according to claim 16 , wherein the first electronic processing circuit coupled to the first signal line via a first connection portion and the second electronic processing circuit coupled to the second signal line via a second connection portion.