Electronic component

1. An electronic component, comprising:

an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction; and

a plurality of external electrodes disposed at both end portions of the element body in the third direction, wherein

the plurality of external electrodes includes a plating layer including a first portion covering the first principal surface and a pair of second portions covering the pair of side surfaces, and

a thickness of the first portion is smaller than each thickness of the pair of second portions.

2. The electronic component according to claim 1 , wherein

each area of the pair of second portions is smaller than an area of the first portion.

3. The electronic component according to claim 1 , wherein

each of the pair of second portions is disposed in a region near the first principal surface of a corresponding side surface of the pair of side surfaces.

4. The electronic component according to claim 1 , wherein

each of the plurality of external electrodes includes a conductive resin layer covering one part of the first principal surface and one part of each of the pair of side surfaces, and

the plating layer is disposed on the conductive resin layer.

5. The electronic component according to claim 4 , wherein

each of the plurality of external electrodes is formed on a corresponding end surface of the pair of end surfaces, and

the conductive resin layer further covers one part of the corresponding end surface.

6. The electronic component according to claim 5 , further comprising:

an internal conductor exposed to the corresponding end surface of the pair of end surfaces, wherein

each of the plurality of external electrodes further includes a sintered metal layer formed at least on the end surface to be connected to the internal conductor.

7. The electronic component according to claim 6 , wherein

the sintered metal layer includes a first region covered with the conductive resin layer, and a second region exposed from the conductive resin layer.

8. The electronic component according to claim 6 , wherein

the sintered metal layer is also formed on a first ridge portion located between the first principal surface and the end surface, and

the conductive resin layer covers an entirety of a portion of the sintered metal layer formed on the first ridge portion.

9. The electronic component according to claim 6 , wherein

the sintered metal layer is also formed on a second ridge portion located between the side surface and the end surface, and

the conductive resin layer covers one part of a portion of the sintered metal layer formed on the second ridge portion.

10. The electronic component according to claim 1 , wherein

the plating layer includes an outermost layer, and an intermediate layer that is located inside the outermost layer and includes an Ni plating layer.

11. The electronic component according to claim 1 , wherein

the plating layer includes an outermost layer including an Sn plating layer.

12. An electronic component, comprising:

an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction; and

an external electrode disposed at an end portion of the element body in the third direction, wherein

the external electrode includes a plating layer including a first portion covering the first principal surface and a pair of second portions covering the pair of side surfaces, and

a thickness of the first portion is smaller than each thickness of the pair of second portions.