Interposer with interconnects and methods of manufacturing the same
An interposer includes an interposer substrate having a series of vias, and a series of metallic interconnects in the series of vias. The interposer substrate has a first surface and a second surface opposite the first surface. The interposer substrate includes a dielectric material. A first pitch of the series of vias at a first end of the series of vias is different than a second pitch of the series of vias at a second end of the series of vias.
1. An interposer, comprising:
an interposer substrate comprising a plurality of vias, the interposer substrate having a first surface and a second surface opposite the first surface; and
a plurality of metallic interconnects in the plurality of vias,
wherein the interposer substrate comprises a dielectric material,
wherein a first pitch of the plurality of vias at a first end of the plurality of vias is different than a second pitch of the plurality of vias at a second end of the plurality of vias,
wherein the plurality of metallic interconnects are slanted at angles relative to the first surface of the interposer substrate,
wherein the angles at which the plurality of metallic interconnects are slanted relative to the first surface of the interposer substrate varies between the plurality of metallic interconnects, and
wherein the angle of at least one metallic interconnect of the plurality of metallic interconnects varies non-uniformly.
2. The interposer of claim 1 , wherein the first pitch of the plurality of vias is at the first surface of the interposer substrate and the second pitch of the plurality of vias is at the second surface of the interposer substrate.
3. The interposer of claim 2 , wherein:
a first metallic interconnect of the plurality of metallic interconnects proximate to a center of the interposer substrate is oriented at an angle of about 90 degrees relative to the first surface, and
a second metallic interconnect of the plurality of metallic interconnects comprises a bend at an intermediate position between the first and second surfaces of the interposer substrate, the bend extending in a direction away from the first metallic interconnect.
4. The interposer of claim 3 , wherein the second metallic interconnect comprises a first segment extending from the first surface to the bend, and a second segment extending from the bend to the second surface.
5. The interposer of claim 4 , wherein the first segment is substantially orthogonal to the first surface, and the second surface is substantially orthogonal to the second surface.
6. The interposer of claim 4 , wherein the first segment is slanted relative to the first surface, or the second segment is slanted relative to the second surface.
7. The interposer of claim 3 , wherein the bend is substantially parallel to the first and second surfaces.
8. The interposer of claim 1 , wherein the angle of one metallic interconnect of the plurality of metallic interconnects proximate to a center of the interposer substrate is about 90 degrees.
9. The interposer of claim 8 , wherein the angles of the plurality of metallic interconnects decrease with increasing distance from the center of the interposer substrate.
10. The interposer of claim 9 , wherein the angles decrease non-uniformly.
11. The interposer of claim 1 , wherein the interposer substrate has a thickness from about 0.3 mm to about 5 mm, and wherein a diameter of each of the plurality of metallic interconnects is from about 1 μm to about 1000 μm.
12. The interposer of claim 1 , wherein the dielectric material of the interposer substrate is selected from the group of materials consisting of dielectric glass, ceramic, polymer, and combinations thereof.
13. An interposer, comprising:
an interposer substrate comprising a plurality of vias, the interposer substrate having a first surface and a second surface opposite the first surface; and
a plurality of metallic interconnects in the plurality of vias,
wherein the interposer substrate comprises a dielectric material,
wherein a first pitch of the plurality of vias at a first end of the plurality of vias is different than a second pitch of the plurality of vias at a second end of the plurality of vias, and
wherein at least a portion of one metallic interconnect of the plurality of metallic interconnects is spiral-shaped.
14. An interposer, comprising:
an interposer substrate comprising a plurality of vias, the interposer substrate having a first surface and a second surface opposite the first surface; and
a plurality of metallic interconnects in the plurality of vias,
wherein the interposer substrate comprises a dielectric material,
wherein a first pitch of the plurality of vias at the first surface of the interposer substrate is different than a second pitch of the plurality of vias at the second surface of the interposer substrate, and
wherein at least one of the plurality of metallic interconnects has a first diameter at the first surface and a second diameter greater than the first diameter at the second surface.
15. A method of manufacturing an interposer, the method comprising:
forming an interposer substrate comprising a plurality of vias, the interposer substrate having a first surface and a second surface opposite the first surface; and
forming a plurality of metallic interconnects,
wherein the plurality of metallic interconnects are in the plurality of vias,
wherein the interposer substrate comprises a dielectric material,
wherein a first pitch of the plurality of vias at a first end of the plurality of vias is different than a second pitch of the plurality of vias at a second end of the plurality of vias, and
wherein the forming the interposer substrate comprises three-dimensional printing the interposer substrate from a pre-ceramic polymer resin by stereolithography or digital light processing, and pyrolyzing the pre-ceramic polymer resin into a glass ceramic material.
16. The method of claim 15 , wherein the first pitch of the plurality of vias is at the first surface of the interposer substrate and the second pitch of the plurality of vias is at the second surface of the interposer substrate.
17. The method of claim 15 , wherein:
forming the plurality of metallic interconnects comprises three-dimensional printing the plurality of metallic interconnects.
18. The method of claim 15 , wherein the forming the plurality of metallic interconnects is performed by a process selected from the group of processes consisting of atomic layer deposition, electroless plating, electroplating, electroforming from a conductive substrate, injection of a metallic paste, metal melt infiltration, and combinations thereof.
19. The method of claim 15 , wherein the forming the plurality of metallic interconnects comprises metal melt infiltration of a conductive material selected from the group consisting of solder, braze, Ag—Cu eutectic, pure silver, and combinations thereof.
20. The method of claim 15 , A method of manufacturing an interposer, the method comprising:
forming an interposer substrate comprising a plurality of vias, the interposer substrate having a first surface and a second surface opposite the first surface; and
forming a plurality of metallic interconnects,
wherein the plurality of metallic interconnects are in the plurality of vias,
wherein the interposer substrate comprises a dielectric material,
wherein a first pitch of the plurality of vias at a first end of the plurality of vias is different than a second pitch of the plurality of vias at a second end of the plurality of vias, and
wherein the forming the interposer substrate and the forming the plurality of metallic interconnects are performed concurrently by a multi-material additive manufacturing process.
21. The method of claim 20 , wherein the multi-material additive manufacturing process is selected from the group of processes consisting of micro-extrusion, aerosol jet printing, laser induced forward transfer, and combinations thereof.