Light emitting device and method for producing the same
A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
1. A method of manufacturing a light emitting device, the method comprising:
providing a structure comprising:
a substrate that includes a first wiring electrode and a second wiring electrode located at an upper surface of the substrate,
a light emitting element mounted on the upper surface of the substrate,
a wavelength conversion member disposed on or above an upper surface of the light emitting element,
a light-transmissive member disposed on an upper surface of the wavelength conversion member, and
a light reflective member that includes:
a portion disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, and
a portion disposed on an upper surface of the light-transmissive member;
removing a portion of the light-transmissive member and the portion of the light reflective member that is disposed on the upper surface of the light-transmissive member so that the light-transmissive member is exposed from the light reflective member as viewed from an upper side of the structure.
2. The method of manufacturing a light emitting device according to claim 1 , wherein, after removing said portion of the light reflective member, a thickness of the light-transmissive member is less than a thickness of the wavelength conversion member.
3. The method of manufacturing a light emitting device according to claim 1 , wherein, after the removing step, an upper surface of the light reflective member is coplanar with the upper surface of the light-transmissive member.
4. The method of manufacturing a light emitting device according to claim 1 , wherein the light reflective member includes silicone resin and TiO 2 .
5. The method of manufacturing a light emitting device according to claim 1 , wherein the wavelength conversion member includes a phosphor adapted to emit red light and a phosphor adapted to emit green light.
6. The method of manufacturing a light emitting device according to claim 5 , wherein the phosphor adapted to emit red light is a KSF-based phosphor, and the phosphor adapted to emit green light is a β-SiAlON-based phosphor.
7. The method of manufacturing a light emitting device according to claim 1 , wherein an additional light-transmissive member is located between the light emitting element and the wavelength conversion member.
8. The method of manufacturing a light emitting device according to claim 7 , wherein the additional light-transmissive member covers the upper surface of the light emitting element and a portion of a side surface of the light emitting element.
9. The method of manufacturing a light emitting device according to claim 1 , wherein a side surface of the light-transmissive member is flush with a side surface of the wavelength conversion member.
10. A method of manufacturing a light emitting device, the method comprising:
providing a structure comprising:
a substrate that includes a first wiring electrode and a second wiring electrode located at an upper surface of the substrate,
a light emitting element mounted on the upper surface of the substrate,
a wavelength conversion member disposed on or above an upper surface of the light emitting element,
a light-transmissive member disposed on an upper surface of the wavelength conversion member, and
a light reflective member that includes:
a portion disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, and
a portion disposed on an upper surface of the light-transmissive member;
removing the portion of the light reflective member that is disposed on the upper surface of the light-transmissive member so that the light-transmissive member is exposed from the light reflective member as viewed from an upper side of the structure,
wherein, after removing said portion of the light reflective member, a thickness of the light-transmissive member is less than a thickness of the wavelength conversion member.
11. The method of manufacturing a light emitting device according to claim 10 , wherein, after the removing step, an upper surface of the light reflective member is coplanar with the upper surface of the light-transmissive member.
12. The method of manufacturing a light emitting device according to claim 10 , wherein the light reflective member includes silicone resin and TiO 2 .
13. The method of manufacturing a light emitting device according to claim 10 , wherein the wavelength conversion member includes a phosphor adapted to emit red light and a phosphor adapted to emit green light.
14. The method of manufacturing a light emitting device according to claim 13 , wherein the phosphor adapted to emit red light is a KSF-based phosphor, and the phosphor adapted to emit green light is a 0-SiAlON-based phosphor.
15. The method of manufacturing a light emitting device according to claim 10 , wherein an additional light-transmissive member is located between the light emitting element and the wavelength conversion member.
16. The method of manufacturing a light emitting device according to claim 15 , wherein the additional light-transmissive member covers the upper surface of the light emitting element and a portion of a side surface of the light emitting element.
17. The method of manufacturing a light emitting device according to claim 10 , wherein a side surface of the light-transmissive member is flush with a side surface of the wavelength conversion member.
18. A method of manufacturing a light emitting device, the method comprising:
providing a structure comprising:
a substrate that includes a first wiring electrode and a second wiring electrode located at an upper surface of the substrate,
a light emitting element mounted on the upper surface of the substrate,
a wavelength conversion member disposed on or above an upper surface of the light emitting element,
a light-transmissive member disposed on an upper surface of the wavelength conversion member, and
a light reflective member that includes:
a portion disposed on each side surface of the light emitting element, the wavelength conversion member, and the light-transmissive member, and
a portion disposed on an upper surface of the light-transmissive member;
removing the portion of the light reflective member that is disposed on the upper surface of the light-transmissive member so that the light-transmissive member is exposed from the light reflective member as viewed from an upper side of the structure,
wherein an additional light-transmissive member is located between the light emitting element and the wavelength conversion member, and
wherein the additional light-transmissive member covers the upper surface of the light emitting element and a portion of a side surface of the light emitting element.
19. The method of manufacturing a light emitting device according to claim 18 , wherein, after the removing step, an upper surface of the light reflective member is coplanar with the upper surface of the light-transmissive member.
20. The method of manufacturing a light emitting device according to claim 18 , wherein the light reflective member includes silicone resin and TiO 2 .
21. The method of manufacturing a light emitting device according to claim 18 , wherein the wavelength conversion member includes a phosphor adapted to emit red light and a phosphor adapted to emit green light.
22. The method of manufacturing a light emitting device according to claim 21 , wherein the phosphor adapted to emit red light is a KSF-based phosphor, and the phosphor adapted to emit green light is a β-SiAlON-based phosphor.
23. The method of manufacturing a light emitting device according to claim 18 , wherein a side surface of the light-transmissive member is flush with a side surface of the wavelength conversion member.