IP Library Granted Patent US 10,604,688
Granted Patent B2
US 10,604,688 · App. 16/061,842 · Granted Mar 31, 2020

Silicone pressure-sensitive adhesive composition

Inventors: Wonbum Jang (Chungchungbukdo, KR); Gunn Jo (Chungchungbukdo, KR); Bokyung Kim (Gyeonggi-do, KR)
Assignee: Dow Silicones Corporation
C09J183/04C08J3/091C08J3/092C08J3/095C08K5/56C08K13/00C08L83/00C09J7/38C08G77/04C08G77/12C08G77/20C08G2170/40
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Quick Facts
Patent No.
US 10,604,688
App. No.
16/061,842
Granted
Mar 31, 2020
Kind
B2
Abstract

A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a mixture of an aromatic solvent, and an aliphatic alcohol or an aliphatic ester. Although the silicone pressure-sensitive adhesive composition can be cured by heating at relatively low temperatures, the residual solvent in a silicone pressure-sensitive adhesive can be reduced.

Claims (23)

1. A silicone pressure-sensitive adhesive composition comprising:

(A) a diorganopolysiloxane having at least two alkenyl groups with 2 to 12 carbon atoms in a molecule, in an amount of from 30 to 95 parts by mass;

(B) an organopolysiloxane comprising R 1 3 SiO 1/2 and SiO 4/2 units, wherein R 1 s independently represent monovalent hydrocarbon groups with 1 to 12 carbon atoms, and having a molar ratio of (R 1 3 SiO 1/2 )/(SiO 4/2 ) units of 0.6 to 1.7, in an amount of from 5 to 70 parts by mass;

(C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in such an amount that a molar ratio of the silicon-bonded hydrogen atoms in component (C) per the alkenyl groups in components (A) and (B) is 0.1 to 20;

(D) a hydrosilylation catalyst for the addition reaction of the alkenyl groups with the silicon- bonded hydrogen atoms, in an amount to enhance a hydrosilylation of the composition; and

(E) an azeotropic solvent;

wherein the total amount of components (A) and (B) is 100 parts by mass; and

wherein the azeotropic solvent (E) is present in a sufficient amount to apply the composition to a substrate.

2. The silicone pressure-sensitive adhesive composition of claim 1 , wherein the azeotropic solvent comprises an aromatic solvent, and an aliphatic alcohol with at least three carbon atoms or an aliphatic ester.

3. The silicone pressure-sensitive adhesive composition of claim 2 , wherein the aromatic solvent is toluene, xylene, or a mixture thereof.

4. The silicone pressure-sensitive adhesive composition of claim 2 , wherein the aliphatic alcohol is present and is isopropyl alcohol.

5. The silicone pressure-sensitive adhesive composition of claim 2 , wherein the aliphatic ester is present and is methyl acetate, ethyl acetate, or a mixture thereof.

6. The silicone pressure-sensitive adhesive composition of claim 1 , further comprising (F) an inhibitor.

7. The silicone pressure-sensitive adhesive composition of claim 6 , wherein component (F) is present in an amount of from 0.001 to 50 parts by mass per 100 parts by mass of components (A) and (B).

8. The silicone pressure-sensitive adhesive composition of claim 1 , wherein component (E) comprises an aromatic solvent and an aliphatic alcohol with at least three carbon atoms.

9. The silicone pressure-sensitive adhesive composition of claim 8 , wherein the aromatic solvent is toluene, xylene, or a mixture thereof, and the aliphatic alcohol is isopropyl alcohol.

10. The silicone pressure-sensitive adhesive composition of claim 1 , wherein component (E) comprises an aromatic solvent and an aliphatic ester.

11. The silicone pressure-sensitive adhesive composition of claim 10 , wherein the aromatic solvent is toluene, xylene, or a mixture thereof, and the aliphatic ester is methyl acetate, ethyl acetate, or a mixture thereof.

12. A silicone pressure-sensitive adhesive formed from the silicone pressure-sensitive adhesive composition according to claim 1 .

13. A composite article comprising a silicone pressure-sensitive adhesive layer disposed on a substrate, wherein the silicone pressure-sensitive adhesive layer is formed from the silicone pressure-sensitive adhesive composition according to claim 1 .

14. A method of forming the composite article according to claim 13 , the method comprising:

applying the silicone pressure-sensitive adhesive composition to the substrate; and

curing the silicone pressure-sensitive adhesive composition to form the silicone pressure-sensitive adhesive layer on the substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: JANG, WONBUM; JO, GUNN; KIM, BOKYUNG
To: DOW CORNING KOREA LTD.
Reel/Frame 046083/0178 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: DOW CORNING KOREA LTD.
To: DOW CORNING CORPORATION
Reel/Frame 046083/0229 →
CHANGE OF NAME Recorded Jun 14, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 046085/0284 →
Continuity (2)
Provisional Application 62267323 · Dec 15, 2015
Related Publication 20180362816A1 · Dec 20, 2018