IP Library › Granted Patent US 10,606,135
Granted Patent B2
US 10,606,135 · App. 15/994,437 · Granted Mar 31, 2020

Liquid crystal panel, method for fabricating thereof and display apparatus

Inventors: Yung-jui Lee (Huizhou Guangdong, CN); Chengwen Que (Huizhou Guangdong, CN)
Assignee: HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
G02F1/13452G02F1/1339H01L23/498H01L23/4985H01L24/50H01L24/86G02F1/1345G02F2001/13398H01L23/49805H01L23/49861H01L23/49883H01L24/27H01L24/31
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Quick Facts
Patent No.
US 10,606,135
App. No.
15/994,437
Granted
Mar 31, 2020
Kind
B2
Abstract

The present invention discloses a liquid crystal panel, includes a color filter substrate, an array substrate, a liquid crystal disposed between the color filter substrate and the array substrate, a chip on film, a driver chip and a circuit board disposed on the chip on film, one end of the chip on film is bonded to an end face of the array substrate and is electrically connected with a metal line array in the array substrate, the other end of the chip on film is bound with the circuit board. The invention also discloses a method for fabricating a liquid crystal panel and a display apparatus. When applying signal to the liquid crystal panel, the chip on film is bonded to the end face of the array substrate to realize the conduction of the metal line array avoiding the longer bonding region extended from a side of the TFT substrate.

Claims (10)

1. A liquid crystal panel, comprising: a color filter substrate, an array substrate, liquid crystal disposed between the color filter substrate and the array substrate, a chip on film, a driver chip and a circuit board disposed on the chip on film, wherein an end of the chip on film is bonded to an end face of the array substrate, and is electrically connected to a metal line array in the array substrate, another end of the chip on film is bonded to the circuit board;

wherein an end face of the color filter substrate protrudes past the end face of the array substrate to form a protrusion portion, and the chip on film is blocked by the protrusion portion of the color filter substrate.

2. The liquid crystal panel according to claim 1 , wherein a conductive adhesive layer is adhered between the end face of the array substrate and the chip on film, the conductive adhesive layer is electrically connected to the metal line array.

3. The liquid crystal panel according to claim 2 , wherein a frame glue is enclosed in a periphery between the color filter substrate and the array substrate, conductive dots are formed on the end faces of the array substrate and the frame glue, the metal line array is led out to be electrically connected to the conductive dots, the conductive adhesive layer encapsulates the conductive dots therein.

4. The liquid crystal panel according to claim 1 , wherein a conductive adhesive layer is adhered between the end face of the array substrate and the chip on film, the conductive adhesive layer is electrically connected to the metal line array.

5. The liquid crystal panel according to claim 4 , wherein a frame glue is enclosed in a periphery between the color filter substrate and the array substrate, conductive dots are formed on the end faces of the array substrate and the frame glue, the metal line array is led out to be electrically connected to the conductive dots, the conductive adhesive layer encapsulates the conductive dots therein.

6. A display apparatus, comprising a liquid crystal panel and a backlight module, the liquid crystal panel comprising a color filter substrate, an array substrate, liquid crystal disposed between the color filter substrate and the array substrate, a chip on film, a driver chip and a circuit board disposed on the chip on film, wherein an end of the chip on film is bonded to an end face of the array substrate, and is electrically connected to a metal line array in the array substrate, another end of the chip on film is bonded to the circuit board, and the backlight module is disposed on a side of the array substrate; wherein an end face of the color filter substrate protrudes past the end face of the array substrate to form a protrusion portion, and the chip on film is blocked by the protrusion portion of the color filter substrate.

7. The display apparatus according to claim 6 , wherein a conductive adhesive layer is adhered between the end face of the array substrate and the chip on film, the conductive adhesive layer is electrically connected to the metal line array.

8. The display apparatus according to claim 7 , wherein a frame glue is enclosed in a periphery between the color filter substrate and the array substrate, conductive dots are formed on the end faces of the array substrate and the frame glue, the metal line array is led out to be electrically connected to the conductive dots, the conductive adhesive layer encapsulates the conductive dots therein.

9. The display apparatus according to claim 6 , wherein a conductive adhesive layer is adhered between the end face of the array substrate and the chip on film, the conductive adhesive layer is electrically connected to the metal line array, a frame glue is enclosed in a periphery between the color filter substrate and the array substrate, conductive dots are formed on the end faces of the array substrate and the frame glue, the metal line array is led out to be electrically connected to the conductive dots, the conductive adhesive layer encapsulates the conductive dots therein.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2018
From: LEE, YUNG-JUI; QUE, CHENGWEN
To: HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 046284/0670 →
Priority Claims (1)
CN 2017 1 1480164 · Dec 29, 2017 · national
Continuity (2)
Continuation PCTCN2018073091 · Jan 17, 2018
Related Publication 20190204669A1 · Jul 4, 2019