IP Library › Granted Patent US 10,607,785
Granted Patent B2
US 10,607,785 · App. 15/418,008 · Granted Mar 31, 2020

Electronic component and electronic device

Inventors: Tadashi Aizawa (Matsumoto, JP); Seiji Osawa (Minowa-machi, JP)
Assignee: Seiko Epson Corporation
H01G4/40G01S19/13G01S19/14G01S19/19H01F27/40H01Q1/273H01Q9/0407H03H1/00H01F5/003H03H2001/0021
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Quick Facts
Patent No.
US 10,607,785
App. No.
15/418,008
Granted
Mar 31, 2020
Kind
B2
Abstract

An electronic component includes an antenna electrode functioning as a first electrode plate, a circuit board functioning as a second electrode plate, and a short-circuit section that electrically connects the antenna electrode and the circuit board. The circuit board includes a surface functioning as a first surface opposed to the antenna electrode, a grounding section, a circuit component functioning as a conductive structure disposed on the surface, and a wiring pattern that connects the circuit component and the grounding section.

Claims (35)

1. An electronic component comprising:

a first electrode plate being an antenna electrode;

a second electrode plate including a first surface facing the first electrode plate, a grounding section, a circuit component disposed on the first surface to obtain a wavelength reducing effect, and a wire configured to connect the circuit component and the grounding section; and

a connecting section configured to electrically connect the first electrode plate and the second electrode plate.

2. An electronic component comprising:

a first electrode plate being an antenna electrode;

a second electrode plate; and

a power feeding portion provided on the second electrode plate,

wherein the second electrode plate includes:

a first surface facing the first electrode plate;

a grounding section;

a circuit component disposed on the first surface to obtain a wavelength reducing effect; and

a wire configured to connect the circuit component and the grounding section.

3. The electronic component according to claim 1 , wherein the second electrode plate is a circuit board.

4. The electronic component according to claim 2 , wherein the second electrode plate is a circuit board.

5. The electronic component according to claim 3 , wherein the circuit board is a board on which an electric conductor and an insulator are stacked.

6. The electronic component according to claim 4 , wherein the circuit board is a board on which an electric conductor and an insulator are stacked.

7. The electronic component according to claim 1 , wherein the circuit component is at least any one of an integrated circuit, a stud, a conductor block, and a shield case.

8. The electronic component according to claim 2 , wherein the circuit component is at least any one of an integrated circuit, a stud, a conductor block, and a shield case.

9. The electronic component according to claim 1 , wherein the connecting section short-circuits the first electrode plate and the second electrode plate.

10. The electronic component according to claim 2 , wherein the connecting section short-circuits the first electrode plate and the second electrode plate.

11. The electronic component according to claim 1 , wherein a resonant frequency of the electronic component satisfies a following expression:

the resonant frequency=1/{2×π×( L×C ) 1/2 .

where,

C represents capacitance obtained by combining equivalent capacitance of the electronic component and equivalent capacitance added by the circuit component, and

L represents inductance obtained by combining equivalent inductance of the electronic component and equivalent inductance added by the circuit component.

12. The electronic component according to claim 2 , wherein a resonant frequency of the electronic component satisfies a following expression:

the resonant frequency=1/{2×π×( L×C ) 1/2 .

where,

C represents capacitance obtained by combining equivalent capacitance of the electronic component and equivalent capacitance added by the circuit component, and

L represents inductance obtained by combining equivalent inductance of the electronic component and equivalent inductance added by the circuit component.

13. The electronic component according to claim 11 , wherein width of the wire that connects the circuit component and the grounding section directly or via a capacitor is larger than width of other wires connected to components other than the circuit component.

14. The electronic component according to claim 12 , wherein width of the wire that connects the circuit component and the grounding section directly or via a capacitor is larger than width of other wires connected to components other than the circuit component.

15. An electronic device comprising the electronic component according to claim 1 .

16. An electronic device comprising the electronic component according to claim 2 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2017
From: AIZAWA, TADASHI; OSAWA, SEIJI
To: SEIKO EPSON CORPORATION
Reel/Frame 041108/0633 →
Priority Claims (1)
JP 2016-015751 · Jan 29, 2016 · national
Continuity (1)
Related Publication 20170221636A1 · Aug 3, 2017
Cited By (1)
US 12,191,563