Fabrication of a pair of vertical fin field effect transistors having a merged top source/drain
A method of fabricating a vertical fin field effect transistor with a merged top source/drain, including, forming a source/drain layer at the surface of a substrate, forming a plurality of vertical fins on the source/drain layer; forming protective spacers on each of the plurality of vertical fins, forming a sacrificial plug between two protective spacers, forming a filler layer on the protective spacers not in contact with the sacrificial plug, and selectively removing the sacrificial plug to form an isolation region trench between the two protective spacers.
1. A method of fabricating a vertical fin field effect transistor with a merged top source/drain, comprising:
forming a source/drain layer at the surface of a substrate;
forming a plurality of vertical fins on the source/drain layer with a hardmask cap on each of the plurality of vertical fins;
forming a sacrificial plug between two of the plurality of vertical fins;
planarizing the hardmask caps on the plurality of vertical fins and the sacrificial plug by chemical-mechanical polishing;
selectively removing the sacrificial plug to form an isolation region trench between the two of the plurality of vertical fins;
extending the isolation region trench through the source/drain layer into the substrate; and
forming a dummy layer in the isolation region trench and on the source/drain layer.
2. The method of claim 1 , further comprising patterning the dummy layer and forming at least two additional isolation region trenches in the source/drain layer and substrate.
3. The method of claim 2 , further comprising removing the dummy layer and forming a trench fill layer in the at least three isolation region trenches.
4. The method of claim 3 , further comprising etching back the trench fill layer to form a plurality of shallow trench isolation regions, and forming a gate structure on each of the plurality of vertical fins.
5. The method of claim 4 , further comprising forming a top source/drain on each of the plurality of vertical fins having a predetermined size, where the predetermined size is sufficient for at least two top source/drains to coalesce into a merged source/drain.
6. The method of claim 5 , wherein the distance between at least two of the plurality of vertical fins is in the range of about 10 nm to about 40 nm, and the predetermined size of the at least two top source/drains is greater than the distance between the at least two vertical fins.
7. The method of claim 5 , wherein the distance between the plurality of vertical fins other than the at least two vertical fins is in the range of about 30 nm to about 100 nm.
8. The method of claim 7 , wherein the predetermined size of the top source/drains other than the at least two top source/drains is less than the distance between the plurality of vertical fins other than the at least two vertical fins.