IP Library Granted Patent US 10,608,359
Granted Patent B2
US 10,608,359 · App. 15/843,066 · Granted Mar 31, 2020

Connection structure between flat cable and electronic circuit board

Inventor: Sung-soo Kim (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01R12/79H01R12/7023H01R12/718H01R12/778H05K1/184H01R12/88H05K2201/09181H05K2201/09645H05K2201/10189H05K2201/10356
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Quick Facts
Patent No.
US 10,608,359
App. No.
15/843,066
Granted
Mar 31, 2020
Kind
B2
Abstract

A connection structure between a flat cable and an electronic circuit board includes an electronic circuit board; a cable connection hole formed to penetrate the electronic circuit board; a plurality of internal contacts provided on an inner surface of the cable connection hole; and a flat cable provided with a plurality of contacts which correspond to the plurality of internal contacts of the cable connection hole and are exposed to one side surface of the flat cable. When one end of the flat cable is inserted into the cable connection hole of the electronic circuit board, the plurality of contacts of the flat cable are in contact with the plurality of internal contacts of the cable connection hole, respectively.

Claims (42)

1. A connection structure between a flat cable and an electronic circuit board, the connection structure comprising:

an electronic circuit board;

a cable connection hole formed to penetrate the electronic circuit board and in a substantially rectangular shape;

a plurality of internal contacts provided on a side surface of an inner surface of the cable connection hole; and

a flat cable provided with a plurality of contacts which correspond to the plurality of internal contacts of the cable connection hole and are exposed through a portion of one side surface of the flat cable,

wherein an opposite portion of another side surface of the flat cable which is opposite to the portion of the one side surface through which the plurality of contacts are exposed is not opened, and

wherein when one end of the flat cable is inserted into the cable connection hole of the electronic circuit board, the plurality of contacts of the flat cable are in contact with the plurality of internal contacts of the cable connection hole by the opposite portion of the flat cable, respectively.

2. The connection structure of claim 1 , wherein

each of the plurality of internal contacts comprises:

a contact groove which is formed in the inner surface of the cable connection hole and includes a semicircular cross-section; and

a conductive layer which is formed on an inner surface of the contact groove at a predetermined height and includes electrical conductivity.

3. The connection structure of claim 2 , wherein

each of the plurality of internal contacts further comprises a filling member which is filled on the conductive layer at a level equal to the inner surface of the cable connection hole and includes electrical conductivity.

4. The connection structure of claim 3 , wherein

each of the plurality of internal contacts further comprises a plating layer formed of an electrically conductive material on a surface of the filling member exposed to the inner surface of the cable connection hole.

5. The connection structure of claim 2 , wherein

contact grooves and conductive layers of the plurality of internal contacts are provided by forming a plurality of via holes in the electronic circuit board and forming the cable connection hole penetrating the electronic circuit board, wherein a plane passing through centers of the plurality of via holes is the inner surface of the cable connection hole.

6. The connection structure of claim 1 , wherein

the plurality of internal contacts are perpendicular to one surface of the electronic circuit board on which the cable connection hole is formed.

7. The connection structure of claim 1 , wherein

the plurality of internal contacts are inclined with respect to one surface of the electronic circuit board on which the cable connection hole is formed.

8. The connection structure of claim 1 , wherein

a circumference of an inlet of the cable connection hole into which the flat cable is inserted is chamfered.

9. The connection structure of claim 1 , wherein

the flat cable comprises:

a base portion;

a cover portion;

a plurality of conductive lines provided between the base portion and the cover portion;

a connection opening formed in the cover portion and spaced apart from one end of the cover portion, wherein a part of each of the plurality of conductive lines is exposed through the connection opening; and

a support portion provided on the base portion opposite to the cover portion at a position corresponding to the connection opening,

wherein the part of each of the plurality of conductive lines exposed through the connection opening forms each of the plurality of contacts.

10. The connection structure of claim 9 , wherein

a part of the support portion is separated from the base portion, and

wherein the flat cable further comprises a silicon tape attached to the part of the support portion separated from the base portion.

11. The connection structure of claim 9 , wherein

a thickness of the support portion is larger than a thickness of the base portion.

12. The connection structure of claim 9 , wherein

an edge of one end of the support portion corresponding to the one end of the flat cable is chamfered.

13. The connection structure of claim 9 , wherein

the one end of the flat cable is provided with a tapered insertion structure.

14. The connection structure of claim 13 , wherein

a pair of fixing grooves is provided adjacent to both sides of the connection opening of the flat cable.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2017
From: KIM, SUNG-SOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 044891/0398 →
Priority Claims (1)
KR 10-2017-0049886 · Apr 18, 2017 · national
Continuity (3)
Provisional Application 62436541 · Dec 20, 2016
Provisional Application 62435161 · Dec 16, 2016
Related Publication 20180175531A1 · Jun 21, 2018