Method for manufacturing light-emitting device, method for manufacturing laser module, and light-emitting device
A method for manufacturing a light-emitting device includes: providing a base including a first depressed portion and a second depressed portion both upwardly opening; and positioning and mounting at least one semiconductor laser element on or above the base based on a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view.
1. A method for manufacturing a light-emitting device comprising:
providing a base including a first depressed portion and a second depressed portion both upwardly opening;
positioning and mounting at least one semiconductor laser element on or above the base using a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view as a reference so that the at least one semiconductor laser element is spaced apart from the predetermined point; and
joining a lid to the base to enclose the at least one semiconductor laser element with the lid being disposed between the first depressed portion and the second depressed portion in the plan view, the lid being configured to upwardly transmit light from the at least one semiconductor laser element.
2. The method for manufacturing a light-emitting device according to claim 1 , wherein
the predetermined point is a midpoint of the line connecting the first depressed portion and the second depressed portion.
3. The method for manufacturing a light-emitting device according to claim 1 , further comprising
positioning and mounting a wavelength conversion member on or above the base using the predetermined point as a reference in a plan view,
wherein the wavelength conversion member converts a wavelength of light emitted from the at least one semiconductor laser element.
4. The method for manufacturing a light-emitting device according to claim 1 , further comprising
positioning and mounting a light-reflective member on or above the base using the predetermined point as a reference in a plan view,
wherein the reflecting member reflects light emitted from the at least one semiconductor laser element.
5. The method for manufacturing a light-emitting device according to claim 1 , further comprising:
after the mounting of the at least one semiconductor laser element, operating the at least one semiconductor laser element; and
disposing an optical member on an optical path of laser light emitted from the at least one semiconductor laser element so as to allow the laser light to reach a predetermined position through the optical member in a plan view.
6. A method for manufacturing a light-emitting device comprising:
providing a base including a first depressed portion and a second depressed portion both upwardly opening;
positioning and mounting at least one semiconductor laser element on or above the base using a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view as a reference;
identifying an inner edge of a first metal layer and an inner edge of a second metal layer by image recognition, the first metal layer and the second metal layer being part of the base with the first metal layer being adjacent to and surrounding the first depressed portion and the second metal layer being adjacent to and surrounding the second depressed portion in a plan view;
determining the line connecting the first depressed portion and the second depressed portion using the inner edge of the first metal layer and the inner edge of the second metal layer; and
determining the predetermined point using the line.
7. The method for manufacturing a light-emitting device according to claim 1 , further comprising:
before the mounting of the at least one semiconductor laser element, identifying a center or center of gravity of each of the first depressed portion and the second depressed portion; and
determining the predetermined point using a line connecting the center or center of gravity of the first depressed portion and the center or center of gravity of the second depressed portion.
8. A method for manufacturing a laser module comprising:
manufacturing a light-emitting device by
providing a base including a first depressed portion and a second depressed portion both upwardly opening, and
positioning and mounting at least one semiconductor laser element on or above the base using a predetermined point on a line connecting the first depressed portion and the second depressed portion in a plan view as a reference;
disposing the light-emitting device on a heat dissipation member; and
clamping the light-emitting device between the heat dissipation member and an attachment having a first positioning member and a second positioning member at a position determined by aligning the light-emitting device with respect to the attachment by respectively inserting the first positioning member and the second positioning member into the first depressed portion and the second depressed portion.
9. The method for manufacturing a laser module according to claim 8 , wherein
the first depressed portion is longer than the second depressed portion in a direction along the line connecting the first depressed portion and the second depressed portion in a plan view, and
in the clamping of the light-emitting device, a gap is formed between the first positioning member and a side wall of the first depressed portion in the direction along the line connecting the first depressed portion and the second depressed portion in a state where the light-emitting device is aligned.
10. The method for manufacturing a laser module according to claim 8 , wherein
the second positioning member has a tip portion with a tapered shape having an upper portion having a diameter larger than a diameter of the opening of the second depressed portion and a lower portion having a diameter smaller than the diameter of the opening of the second depressed portion, and
in the clamping the light-emitting device, the second positioning member comes in contact with an upper end of the second depressed portion and the tip portion of the second positioning member does not reach a bottom surface of the second depressed portion in a state where the light-emitting device is aligned.
11. A light-emitting device comprising:
a base including a first depressed portion and a second depressed portion both upwardly opening;
at least one semiconductor laser element disposed on or above the base; and
a lid joined to the base to enclose the at least one semiconductor laser element and upwardly transmit light from the at least one semiconductor laser element, the lid being disposed between the first depressed portion and the second depressed portion in a plan view
wherein a light emitting point of the light-emitting device is located at a position overlapping a predetermined point on a line connecting the first depressed portion and the second depressed portion or at a position a predetermined distance away from the predetermined point in a plan view.
12. The light-emitting device according to claim 11 , wherein
the first depressed portion is longer than the second depressed portion in a direction along the line connecting the first depressed portion and the second depressed portion in a plan view.
13. The light-emitting device according to claim 11 , wherein
the base includes a ceramic portion, and
the first depressed portion and the second depressed portion are disposed in the ceramic portion.
14. The light-emitting device according to claim 13 , wherein
the base includes
a first metal layer adjacent to and surrounding the first depressed portion in a plan view, and
a second metal layer adjacent to and surrounding the second depressed portion in a plan view.
15. The light-emitting device according to claim 11 , wherein
the light emitting point is located on a midpoint of the line connecting the first depressed portion and the second depressed portion or on a perpendicular bisector of the line.
16. The light-emitting device according to claim 11 , wherein
the base has a third depressed portion that is upwardly opening and positioned between the first depressed portion and the second depressed portion, and
the at least one semiconductor laser element is disposed on or above a bottom surface of the third depressed portion.
17. The light-emitting device according to claim 16 , wherein
the lid is joined to the base to cover an opening of the third depressed portion, and
the lid includes a light-transmissive member transmitting the light from the at least one semiconductor laser element.
18. The light-emitting device according to claim 11 , further comprising
a wavelength conversion member converting a wavelength of the light emitted from the at least one semiconductor laser element,
wherein the wavelength conversion member is disposed at a position overlapping the light emitting point in a plan view.
19. The light-emitting device according to claim 11 , further comprising
a light-reflective member upwardly reflecting light emitted from the at least one semiconductor laser element,
wherein the light-reflective member is disposed at a position overlapping the light emitting point in a plan view.