Antenna packaging solution
A first and second antenna substrate are included in an advanced antenna package. Each antenna substrate includes a respective array of antenna elements disposed on a respective first surface of the substrate. A plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates are bonded to the first surface of the first antenna substrate. A first sub-plurality of the stand-off balls are placed at positions in a peripheral region of the first and second antenna substrates. A second sub-plurality of the stand-off balls are placed at interior positions between antenna elements of the first and second antenna substrates. A plurality of adhesive pillars are disposed between and bond the first surfaces of first and second antenna substrates at a plurality of discrete selected locations. A first location of the discrete selected locations is in a peripheral region. A second location of the discrete selected locations is at an interior position between antenna elements.
1. An antenna package comprising:
a first and second antenna substrate, each antenna substrate with a respective array of antenna elements disposed on a respective first surface;
a plurality of stand-off balls disposed between the first surfaces of first and second antenna substrates and bonded to the first surface of the first antenna substrate, a first sub-plurality of the stand-off balls placed at positions in a peripheral region of the first and second antenna substrates and a second sub-plurality of the stand-off balls at interior positions between antenna elements of the first and second antenna substrates;
a plurality of adhesive pillars disposed between and bonding the first surfaces of first and second antenna substrates at a plurality of discrete selected locations, wherein a first location of the discrete selected locations is in a peripheral region and a second location of the discrete selected locations is at an interior position between antenna elements.
2. The device as recited in claim 1 , wherein the first antenna substrate is an antenna lid laminate substrate and the first second antenna substrate is an antenna carrier laminate substrate on which semiconductor chips are bonded on a second surface opposite to the first surface wherein the plurality of stand-off balls and the plurality of adhesive pillars control an air gap between the first and second antenna substrates.
3. The device as recited in claim 1 , wherein the peripheral region is located outside the antenna array.
4. The device as recited in claim 1 , wherein the plurality of stand-off balls comprises a plurality of dielectric beads.
5. The device as recited in claim 1 , wherein the adhesive pillars are circular pillars.
6. The device as recited in claim 1 , wherein at least a subgroup of the plurality of stand-off balls is located where compressive forces are expected and at least subgroup of the adhesive pillars is located where tensile forces are expected.
7. The device as recited in claim 4 , further comprising a composite stand-off ball adhesive pillar which joins the first and second substrates.
8. The device as recited in claim 1 , wherein a minimum number of ball stand-offs and pillars are selected to reduce antenna interference and maintain structural integrity.
9. The device as recited in claim 1 , wherein the respective arrays of antenna elements are uniform in spacing and all of the stand-off balls and adhesive pillars are located at positions between antenna elements.
10. The device as recited in claim 1 , wherein the ball stand-offs are copper balls attached with solder only on the first surface of the first antenna substrate.