Method for producing a decorated wall or floor panel

1. A method for producing a decorated wall or floor panel, comprising the method steps:

a) providing a pourable carrier material;

b) placing the carrier material between two belt conveying means;

c) forming the carrier material under the action of temperature while forming a carrier sheet;

d) compressing the carrier;

e) treating the carrier under the action of pressure by use of a twin belt press at a temperature T1 while reducing the thickness of the carrier by compression factor K1;

f) subsequently treating the carrier under the action of pressure at a temperature T2 while reducing the thickness of the carrier by a compression factor K2, wherein T2<T1, and wherein K2<K1, wherein T1 is in a range of between ≥150° C. and ≤190° C., T2 is in a range between ≥100° C. and ≤150° C., K1 is in a range between >0 and ≤0.3, and K2 is in a range between >0 and ≤0.2;

g) optionally cooling the carrier;

h) optionally applying a decorative subsurface onto at least a portion of the carrier;

i) applying a decoration reproducing a decorative template onto at least a portion of the carrier; and

j) applying a protective layer onto at least a portion of the decoration.

2. The method according to claim 1 , wherein the temperature T1 and the temperature T2 are set by tempering means acting separate from each other.

3. The method according to claim 1 , wherein the method steps e) and f) are carried out in a common twin belt press.

4. The method according to claim 1 , wherein the method steps e) and f) are carried out in two pressing means separated from each other.

5. The method according to claim 4 , wherein the method step f) is carried out in a twin belt press or in a calender.

6. The method according to claim 1 , wherein a carrier material based on a plastic or a wood-plastic composite material is provided.

7. The method according to claim 1 , wherein the carrier is temporarily stored between method steps e) and f).

8. The method according to claim 1 , wherein the carrier is cooled down to a temperature T3 between method steps e) and f), wherein T3<T1 and wherein T3<T2.

9. The method according to claim 1 , wherein the carrier prior or subsequently to method step f) is heated to a temperature which is above the crystallization temperature of a plastic component present in the carrier.

10. The method according to claim 1 , wherein prior to method step e) an anti-adhesive means is disposed such that at least within the twin belt press it is disposed between the carrier and the conveying means.

11. The method according to claim 1 , wherein the carrier is cooled prior to method step e) in particular below the melting point or the softening point of a plastic component of the carrier.

12. The method according to claim 1 , wherein the carrier subsequently to method step f) is heated to a temperature above the crystallization temperature of a plastic present in the carrier.

13. The method according to claim 1 , wherein method step f) is carried out in a twin belt press, wherein belt conveying means used in method step f) each comprise a steel belt coated with polytetrafluoroethylene.

14. The method according to claim 1 , wherein a method step d) is carried out by use of an S-roller.

15. An apparatus for carrying out a method according to claim 1 , comprising;

two endless belt conveying means;

a discharge unit for applying a carrier material between the belt conveying means;

a molding unit for forming a carrier sheet from the carrier material;

a first pressing means for compressing the carrier;

a twin belt press as a pressing means for treating the carrier under the action of pressure at a temperature T1;

optionally a further pressing means,

wherein the apparatus is further configured such that the carrier after the treatment in the twin belt under the action of pressure at a temperature T1 can be treated further at a temperature T2 in the twin belt press or in the further pressing means such that a compression factor K1 can be set at the temperature T1 and a compression factor K2 can be set at the temperature T2, wherein K2<K1, wherein T1 can be set in a range of between ≥150° C. and ≤190° C., T2 can be set in a range between ≥100° C. and ≤150° C., K1 can be set in a range between >0 and ≤0.3, and K2 can be set in a range between >0 and ≤0.2.