Method for producing a reflector element and reflector element
A method for producing a reflector element and a reflector element are disclosed. In an embodiment the method includes depositing a layer sequence on a substrate, wherein the layer sequence includes at least one mirror layer and at least one reactive multilayer system and igniting the reactive multilayer system in order to activate heat input in the layer sequence.
1. A method for producing a reflector element, the method comprising:
depositing a layer sequence on a substrate, wherein the layer sequence comprises at least one mirror layer and at least one reactive multilayer system; and
igniting the reactive multilayer system in order to activate heat input in the layer sequence,
wherein the heat input takes place into the mirror layer causing an increased reflectance of the mirror layer relative to a state of the mirror layer before the heat input.
2. The method according to claim 1 , wherein the reactive multilayer system comprises a plurality of alternating layers of one of the following material pairs: Ti and B, Zr and B, Hf and B, V and B, Nb and B, Ta and B, Ti and C, Zr and C, Hf and C, V and C, Nb and C, Ta and C, Ti and Si, Zr and Si, Hf and Si, V and Si, Nb and Si, Ta and Si, Ti and Al, Zr and Al, Hf and Al, Ni and Al, Pd and Al, Pt and Al, Sc and Au, Sc and Cu, Sc and Ag, Y and Au, Y and Cu, Y and Ag, and Ru and Al.
3. The method according to claim 1 , wherein the reactive multilayer system comprises at least 20 layers.
4. The method according to claim 1 , wherein the reactive multilayer system comprises layers with thicknesses of between 5 nm and 500 nm.
5. The method according to claim 1 , wherein the mirror layer comprises a metal layer.
6. The method according to claim 1 , wherein the layer sequence comprises a protective layer arranged over the mirror layer, and wherein the protective layer is modified by the heat input.
7. The method according to claim 6 , wherein the protective layer comprises MgF 2 , Y 2 O 3 or Al 2 O 3 .
8. The method according to claim 1 , wherein the layer sequence has at least one adhesive layer.
9. The method according to claim 1 , wherein the mirror layer comprises a dielectric interference layer system.
10. The method according to claim 1 , wherein the mirror layer comprises a partial open area in order to allow direct access to the reactive multilayer system.
11. The method according to claim 1 , wherein the reactive multilayer system comprises alternating layers of a first material and a second material, and wherein the first material layer and the second material layer are separated from each other by a diffusion barrier of a third material.
12. The method according to claim 11 , wherein the third material is carbon.