Liquid crystal on silicon packaging
A method of fanning an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.
1. A liquid crystal on silicon (LCOS) panel, comprising:
a silicon substrate including a first surface and a second surface; further including a first conductive pad and a second conductive pad at the first surface;
a display layer including a liquid crystal portion, and a seal surrounding the liquid crystal portion;
a cover glass panel including a cover glass, and a transparent electrode layer formed upon the cover glass;
a printed circuit board (PCB) including a bonding pad, at least one solder ball, and at least one internal connection connecting the bonding pad to the solder ball;
a conductive member coupling the first conductive pad to the bonding pad; and
a conductive adhesive coupling the second conductive pad to the transparent electrode layer;
wherein the display layer is situated between the first surface of the silicon substrate and the transparent electrode layer of the cover glass panel, and wherein the second surface of silicon substrate is situated upon the PCB.
2. The LCOS panel of claim 1 , wherein the display layer further includes a first sealing material layer and a second sealing material layer, wherein the liquid crystal and the seal is situated between the first seal material layer and the second sealing material layer.
3. The LCOS panel of claim 2 , further including an encapsulating material covering the conductive member, the first conductive pad, and the bonding pad.
4. The LCOS panel of claim 3 , further comprising an isolation layer of insulating material formed on the second surface of the silicon substrate.