First and second shields for thermal isolation
View Patent ↗An example device in accordance with an aspect of the present disclosure includes a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component. A second shield is to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield.
1. A system comprising:
a first shield to provide thermal isolation between a first component and a heatsink of a second component, and to provide a cooling channel that is thermally isolated from the heatsink to receive an airflow for the first component, the first shield includes an inner layer of a first material to insulate from convective heat, and an outer layer of a second material to reflect radiant heat;
and a second shield to provide thermal isolation between the first shield and the heatsink, and to provide a thermal barrier region between the first shield and the second shield, the second shield includes a third material to provide anisotropic temperature behavior to resist heat transfer passing through a plane of the second shield from the heatsink toward the first shield, and to facilitate heat transfer along the plane of the second shield.
2. The system of claim 1 , wherein the thermal barrier region is provided as a barrier cooling channel to receive at least a portion of the airflow.
3. The system of claim 1 , wherein the thermal barrier region is filled with a fixed thermal insulator between the first shield and the second shield.
4. The system of claim 1 , wherein the first shield includes an inner cable management feature disposed on an inside face of the first shield facing the first component.
5. The system of claim 1 , wherein the first shield includes an outer cable management feature disposed on an outside face of the first shield facing the second shield.
6. The system of claim 1 , wherein the second shield is integrated with the first shield such that a transition between the second material of the first shield, and the third material of the second shield, serves as the thermal barrier region based on differing thermal properties of the second and third materials.
7. A method, comprising:
providing, by a first shield, thermal isolation between a first component and a heatsink of a second component, based on the first shield establishing a cooling channel that is thermally isolated from the heatsink, to receive an airflow for the first component;
providing, by the first shield, an inner layer of a first material to insulate from convective heat, and an outer layer of a second material to reflect radiant heat;
providing, by a second shield, thermal isolation between the first shield and the heatsink, based on a thermal barrier region established between the first shield and the second shield; and
providing, by the second shield, anisotropic temperature behavior to resist heat transfer passing through a plane of the second shield from the heatsink to the first shield, and to facilitate heat transfer along the plane of the second shield.
8. The method of claim 7 , wherein the thermal barrier region is provided as a barrier cooling channel to receive at least a portion of the airflow.
9. The method of claim 7 , wherein the thermal barrier region is filled with a fixed thermal insulator between the first shield and the second shield.
10. The method of claim 7 , further comprising providing an inner cable management feature disposed on an inside face of the first shield facing the first component.
11. The method of claim 7 , further comprising providing an outer cable management feature disposed on an outside face of the first shield facing the second shield.
12. The method of claim 7 , wherein the second shield is integrated with the first shield such that a transition between the second material of the first shield, and the third material of the second shield, serves as the thermal barrier region based on differing thermal properties of the second and third materials.
13. A system comprising:
a heatsink including an attachment extension to contact a second component, and a cavity to accommodate a first component;
a first shield disposed in the cavity of the heatsink to provide thermal isolation between the heatsink and a first component, and to provide a cooling channel to receive an airflow for the first component that is thermally isolated from the heatsink; and
a second shield disposed in the cavity of the heatsink over the first shield to thermally isolate the first shield from the heatsink, and to provide a thermal barrier region between the first shield and the second shield.
14. The system of claim 13 , wherein the first shield includes a first pass-through to accommodate the attachment extension of the heatsink and maintain thermal isolation of the cooling channel from the attachment extension.
15. The system of claim 13 , wherein the second shield includes a second pass-through to accommodate the attachment extension of the heatsink and maintain thermal isolation of the cooling channel from the attachment extension.
16. The system of claim 13 , wherein the second shield is spaced from the heatsink to provide a second thermal barrier region between the second shield and the heatsink.
17. The system of claim 13 , wherein the second shield is integrated with the heatsink such that a transition between a material of the second shield, and a dissimilar material of the heatsink, serves as the thermal barrier region based on differing thermal properties of the materials of the second shield and the heat sink.