Inductance device and method of manufacturing the same
An inductance device includes a coil provided with at least one electrically conductive turn having a first portion of turn formed on a face of a first substrate, and a second portion of turn. A first end of the first portion is electrically connected to a first end of the second portion by a conductive connection, and the coil has a longitudinal axis, around which the at least one turn is formed, which is perpendicular to a dimension in thickness of the first substrate. The second portion is formed on a face of a second substrate different from the first substrate, with the face of the first substrate facing the face of the second substrate, with the conductive connection extending into an interstitial space located between the face of the first substrate and the face of the second substrate.
1. A microelectronic component comprising:
a coil provided with at least one electrically conductive turn comprising a first portion of turn formed on a first substrate, and a second portion of turn, with a first end of the first portion being electrically connected to a first end of the second portion by a conductive connection, with the coil having a longitudinal axis, around which the at least one turn is formed, which is perpendicular to a direction according to a thickness of the first substrate, wherein
the second portion is formed on a second substrate different from the first substrate, a first face of the first substrate facing a first face of the second substrate, and
at least one area of the first substrate and at least one area of the second substrate are separated by a gap that is free of any layer, the conductive connection extending at least into an interstitial space located between the first face of the first substrate and the first face of the second substrate; and
a magnetic element placed in the interstitial space at least in a zone of the interstitial space located in the at least one turn.
2. The component according to claim 1 , wherein the first portion is formed on the first face of the first substrate or on a second face of the first substrate opposite the first face and/or the second portion is formed on the first face of the second substrate or on a second face of the second substrate opposite the first face.
3. The component according to claim 1 , wherein the conductive connection comprises a portion that extends into the interstitial space and comprises a portion extending into at least one of the first substrate and second substrate.
4. The component according to claim 3 , wherein the portion of the conductive connection extending into at least one of the first substrate and second substrate comprises at least one conductive via passing through said at least one of the first substrate and second substrate.
5. The component according to claim 1 , wherein the conductive connection comprises at least one among the following elements: an electrically conductive layer, an electrically conductive micro-tube or an electrically conductive micropillar, an electrically conductive ball, a paste or an anisotropic conductive film.
6. The component according to claim 1 , wherein the conductive connection is configured to produce a mechanical assembly of the first and second portions.
7. The component according to claim 1 , wherein the conductive connection presents a non-zero dimension, according to the direction in thickness of the first substrate.
8. The component according to claim 1 , wherein the conductive connection comprises a zone in electrical continuity of the first end of the first portion, a zone in electrical continuity of the first end of the second portion, said zones being assembled by direct bonding with or without thermocompression.
9. The component according to claim 1 , wherein at least one among the first and the second substrates comprises an electrically conductive layer overmounted by a dielectric surface layer said electrically conductive layer containing one among the first or the second portions.
10. The component according to claim 1 , wherein the portion of turn formed on at least one among the first substrate and the second substrate is a conductive track.
11. The component according to claim 1 , wherein materials of the first substrate and second substrate, on their first face, are different.
12. The component according to claim 1 , wherein the coil comprises a plurality of turns, with two successive turns of the plurality of turns being electrically connected by a conductive connection between a second end of a first portion of one of the two successive turns and a second end of a second portion of the other of the two successive turns.
13. An electronic system comprising at least one microelectronic component according to claim 1 .
14. The system according to claim 13 , comprising a plurality of microelectronic components having the first substrate in common and different second substrates.
15. The component according to claim 1 , wherein the magnetic element comprises at least one of: a filling of a polymer resin loaded with magnetic particles, a thin film or wires of a magnetic material.