Redistribution circuit structures and methods of forming the same

1. A redistribution circuit structure, comprising:

a first conductive structure;

a dielectric layer, disposed over and exposing a portion of the first conductive structure; and

a second conductive structure, disposed in the dielectric layer to electrically connect to the first conductive structure, and comprising a first conductive layer and a second conductive layer disposed on and electrically connected to the first conductive layer, wherein the first conductive layer comprises a main portion and a conductive protrusion, the conductive protrusion is disposed on an entire edge of an upper surface of the main portion, and a top of the conductive protrusion is higher than the upper surface of the main portion.

2. The redistribution circuit structure of claim 1 , wherein an outside wall of the conductive protrusion is substantially vertical to the upper surface of the main portion.

3. The redistribution circuit structure of claim 1 , wherein an included angle between the upper surface of the main portion and an inside wall of the conductive protrusion is an obtuse angle.

4. The redistribution circuit structure of claim 1 , wherein a portion of the second conductive layer further extends over the dielectric layer.

5. The redistribution circuit structure of claim 4 , wherein a ratio of a thickness from a bottom of the first conductive layer to a lowest upper surface of the second conductive layer to a thickness of the portion of the second conductive layer extending over the dielectric layer is larger than 1.5.

6. The redistribution circuit structure of claim 4 , wherein a total thickness of the dielectric layer and the portion of the second conductive layer thereon is two times larger than a width of the portion of the first conductive structure exposed by the dielectric layer.

7. The redistribution circuit structure of claim 1 , wherein a distance from a lowest portion to a highest portion of the first conductive layer is substantially equal to a lowest portion to a highest portion of the second conductive layer.

8. The redistribution circuit structure of claim 1 , wherein an interface is formed between the first conductive layer and the second conductive layer.

9. The redistribution circuit structure of claim 1 further comprising a barrier layer between the second conductive structure and the dielectric layer and between the second conductive structure and the first conductive structure.

10. The redistribution circuit structure of claim 1 , wherein the main portion is integrated formed with the conductive protrusion.

11. The redistribution circuit structure of claim 1 , wherein the upper surface of the main portion and the top of the conductive protrusion are covered by the second conductive layer.

12. A redistribution circuit structure, comprising:

a first conductive structure;

a dielectric layer, disposed over and exposing a portion of the first conductive structure;

a second conductive structure, disposed in the dielectric layer to electrically connect to the first conductive structure, wherein an upper surface of the second conductive structure comprises a step structure having at least three steps; and

a barrier layer, disposed between the second conductive structure and the dielectric layer and between the second conductive structure and the first conductive structure.

13. The redistribution circuit structure of claim 12 , wherein the step structure comprises three steps.

14. The redistribution circuit structure of claim 12 , wherein a ratio of a thickness from an upper surface of the first conductive structure to a lowest upper surface of the second conductive structure to a thickness of a portion of the second conductive structure over the dielectric layer is larger than 1.5.

15. The redistribution circuit structure of claim 12 , wherein the dielectric layer has no step structure.

16. A method of forming a redistribution circuit structure, comprising:

forming a dielectric layer over a first conductive structure, wherein the dielectric layer comprises a first opening to expose a portion of the first conductive structure;

forming a first mask over the dielectric layer to cover an upper portion of the first opening;

by using the first mask as a mask, forming a first conductive layer in a lower portion of the first opening;

removing the first mask, wherein the first conductive layer comprises a main portion and a conductive protrusion, the conductive protrusion is disposed on an entire edge of an upper surface of the main portion, and a top of the conductive protrusion is higher than the upper surface of the main portion;

forming a second mask over the dielectric layer without covering the first opening;

by using the second mask as a mask, forming a second conductive layer in the upper portion of the first opening on the first conductive layer, so as to form a second conductive structure comprising the first and second conductive layers; and

removing the second mask.

17. The method of claim 16 further comprising forming a barrier layer between the second conductive structure and the dielectric layer and between the second conductive structure and the first conductive structure.

18. The method of claim 16 , wherein at least one third opening of the second mask is formed over the dielectric layer.

19. The method of claim 18 , wherein the second conductive layer is further formed in the at least one third opening.

20. The method of claim 16 , wherein a depth of the lower portion of the first opening is substantially equal to a depth of the upper portion of the first opening.