Thermal printhead
A thermal printhead includes a substrate, a resistor layer with heat generation portions supported by the substrate and aligned in a primary scanning direction, a wiring layer supported by the substrate to form a conductive path to the heat generation portions, an insulating layer interposed between the substrate and the resistor layer, and a reflection layer located opposite to the heat generation portions with respect to the insulating layer. The reflection layer overlaps with the heat generation portions as viewed in a thickness direction of the heat generation portions and has a greater heat reflectivity than the insulating layer.
1. A thermal printhead including:
a substrate;
a resistor layer including a plurality of heat generation portions that are supported by the substrate and are aligned in a primary scanning direction;
a wiring layer that is supported by the substrate and forms a conductive path to the plurality of heat generation portions;
an insulating layer interposed between the substrate and the resistor layer; and
a reflection layer located opposite to the plurality of heat generation portions with respect to the insulating layer, the reflection layer overlapping with the plurality of heat generation portions as viewed in a thickness direction of the plurality of heat generation portions and having a greater heat reflectivity than the insulating layer, wherein
the reflection layer is interposed between the insulating layer and the substrate,
the substrate comprises a single-crystal semiconductor,
the reflection layer comprises Ti, and
the reflection layer includes: a reflection first layer in contact with the substrate; and a reflection second layer formed on the reflection first layer.
2. The thermal printhead according to claim 1 , wherein the substrate comprises Si.
3. The thermal printhead according to claim 1 , wherein the reflection second layer is in contact with the insulating layer.
4. The thermal printhead according to claim 1 , wherein the reflection first layer comprises Ti, and the reflection second layer comprises Cu.
5. The thermal printhead according to claim 1 , wherein the reflection layer is insulated from the wiring layer.
6. The thermal printhead according to claim 1 , wherein the reflection layer is electrically connected to a part of the wiring layer.
7. The thermal printhead according to claim 1 , wherein the substrate includes: a front surface on which the insulating layer is formed; and a protrusion that protrudes from the front surface and extends in the primary scanning direction,
the protrusion includes a peak portion at which a distance from the front surface is the greatest, and a first inclined portion that connects to the peak portion in a secondary scanning direction and is inclined with respect to the front surface, and
the heat generation portions are formed on at least part of the peak portion in the secondary scanning direction and on at least part of the first inclined portion in the secondary scanning direction, straddling a boundary between the peak portion and the first inclined portion.
8. A thermal printhead including:
a substrate;
a resistor layer including a plurality of heat generation portions that are supported by the substrate and are aligned in a primary scanning direction;
a wiring layer that is supported by the substrate and forms a conductive path to the plurality of heat generation portions;
an insulating layer interposed between the substrate and the resistor layer; and
a reflection layer located opposite to the plurality of heat generation portions with respect to the insulating layer, the reflection layer overlapping with the plurality of heat generation portions as viewed in a thickness direction of the plurality of heat generation portions and having a greater heat reflectivity than the insulating layer, wherein
the reflection layer is interposed between the insulating layer and the substrate,
the substrate comprises a single-crystal semiconductor, and
the reflection layer includes a through portion that allows contact between the substrate and the insulating layer.
9. A thermal printhead including:
a substrate;
a resistor layer including a plurality of heat generation portions that are supported by the substrate and are aligned in a primary scanning direction;
a wiring layer that is supported by the substrate and forms a conductive path to the plurality of heat generation portions;
an insulating layer interposed between the substrate and the resistor layer; and
a reflection layer located opposite to the plurality of heat generation portions with respect to the insulating layer, the reflection layer overlapping with the plurality of heat generation portions as viewed in a thickness direction of the plurality of heat generation portions and having a greater heat reflectivity than the insulating layer, wherein
the reflection layer is interposed between the insulating layer and the substrate,
the substrate comprises a single-crystal semiconductor,
the substrate includes: a front surface on which the insulating layer is formed; and a protrusion that protrudes from the front surface and extends in the primary scanning direction,
the protrusion includes a peak portion at which a distance from the front surface is the greatest, and a first inclined portion that connects to the peak portion in a secondary scanning direction and is inclined with respect to the front surface,
the heat generation portions are formed on at least part of the peak portion in the secondary scanning direction and on at least part of the first inclined portion in the secondary scanning direction, straddling a boundary between the peak portion and the first inclined portion, and
the protrusion includes a second inclined portion that is connected to the first inclined portion on the side opposite to the peak portion in the secondary scanning direction, and that is inclined with respect to the front surface at an inclination angle greater than that of the first inclined portion.
10. The thermal printhead according to claim 9 , wherein the protrusion includes a pair of first inclined portions located on both sides of the peak portion in the secondary scanning direction.
11. The thermal printhead according to claim 10 , wherein the protrusion includes a pair of second inclined portions located on both sides of the pair of first inclined portions in the secondary scanning direction.
12. The thermal printhead according to claim 11 , wherein the heat generation portions are formed over an entire length of the peak portion in the secondary scanning direction and over an entire length of the pair of first inclined portions in the secondary scanning direction.
13. The thermal printhead according to claim 10 , wherein the heat generation portions are further formed on at least a part of the second inclined portion in the secondary scanning direction, straddling the boundary between the first inclined portion and the second inclined portion.