IP Library › Granted Patent US 10,633,512
Granted Patent B2
US 10,633,512 · App. 15/603,860 · Granted Apr 28, 2020

Sheet adhesive and adhesion process using the same

Inventors: Hiroshi Kimura (Hachioji, JP); Yoshihide Arai (Hachioji, JP)
Assignee: THREE BOND CO., LTD.
C08K5/13C08K5/17C09J5/04C09J7/25C09J163/00C09J175/04C09J175/06C09J2201/61C09J2463/006C09J2475/006
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Quick Facts
Patent No.
US 10,633,512
App. No.
15/603,860
Granted
Apr 28, 2020
Kind
B2
Abstract

It has conventionally been difficult to achieve a sheet adhesive which adheres in a low temperature (from 20 to 90° C.), and has both of softness and high adhering strength. The present invention realizes a sheet adhesive capable of adhering in a low temperature (from 20 to 90° C.) which exhibits a high adhesiveness in spite of being a soft sheet of thin film, by forming a simulated multiple layer by using an elastomer as a substrate layer, and by forming a reactive layer by means of spraying or application. A sheet adhesive including a substrate layer and a reactive layer, wherein the substrate layer includes a component (A) and a component (B) below, and the reactive layer is formed with a liquid agent including a component (C) below in an amount of from 0.01% by mass to 45% by mass, component (A): a urethane elastomer, component (B): an epoxy resin, component (C): an amine compound and/or phenol compound.

Claims (13)

1. A sheet adhesive comprising a substrate layer and a reactive layer, wherein

the substrate layer comprises a component (A) and a component (B) below, and

the reactive layer is formed with a liquid agent comprising a component (C) below in an amount of from 0.01% by mass to 45% by mass, where said component (C) of said reactive layer is able to react with said component (B),

component (A): a urethane elastomer,

component (B): an epoxy resin,

component (C): an amine compound and/or phenol compound.

2. The sheet adhesive according to claim 1 , wherein the epoxy resin is a solid at 25° C.

3. The sheet adhesive according to claim 1 , wherein the substrate layer is a substrate layer formed with the component (A) and the component (B) in a state compatibilized with each other.

4. The sheet adhesive according to claim 1 , wherein the liquid agent further comprises a coupling agent as a component (E).

5. A thermal curing-type sheet adhesive which comprises the sheet adhesive according to claim 1 .

6. A normal temperature curing-type sheet adhesive which comprises the sheet adhesive according to claim 1 .

7. The sheet adhesive according to claim 1 , where said liquid agent for forming said reactive layer further comprises a solvent (D).

8. The sheet adhesive according to claim 1 , wherein said substrate layer is supported by a first adherend, and said reactive layer is supported by a second adherend.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2017
From: KIMURA, HIROSHI; ARAI, YOSHIHIDE
To: THREE BOND CO., LTD.
Reel/Frame 042493/0994 →
Priority Claims (1)
JP 2016-109684 · Jun 1, 2016 · national
Continuity (1)
Related Publication 20170349789A1 · Dec 7, 2017