Memory device including alignment mark trench
A memory device includes an insulation layer, an interconnection structure disposed in the insulation layer, a dielectric layer disposed on the insulation layer and the interconnection structure, a connection hole disposed on the interconnection structure and penetrates the dielectric layer, an alignment mark trench penetrating the dielectric layer on a peripheral region, a first patterned conductive layer, and a patterned memory material layer. The first patterned conductive layer includes a connection structure at least partly disposed in the connection hole and a first pattern disposed in the alignment mark trench. The patterned memory material layer includes a first memory material pattern disposed on the connection structure and a second memory material pattern disposed in the alignment mark trench. Manufacturing yield and alignment condition of forming the memory device may be improved by disposing a part of the first patterned conductive layer in the alignment mark trench.
1. A memory device, comprising:
an insulation layer, wherein a memory cell region and a peripheral region are defined on the insulation layer;
an interconnection structure disposed in the insulation layer;
a dielectric layer disposed on the insulation layer and the interconnection structure, wherein the dielectric layer is disposed on the memory cell region and the peripheral region;
a connection hole disposed on the interconnection structure and penetrating the dielectric layer on the memory cell region;
an alignment mark trench penetrating the dielectric layer on the peripheral region;
a first patterned conductive layer disposed on the insulation layer, the first patterned conductive layer comprising:
a connection structure at least partly disposed in the connection hole; and
a first pattern disposed in the alignment mark trench; and
a patterned memory material layer disposed on the insulation layer, the patterned memory material layer comprising:
a first memory material pattern disposed on the connection structure; and
a second memory material pattern disposed in the alignment mark trench.
2. The memory device according to claim 1 , wherein the alignment mark trench is partly disposed in the insulation layer, and a bottom surface of the alignment mark trench is lower than a top surface of the interconnection structure in a thickness direction of the insulation layer.
3. The memory device according to claim 1 , wherein a bottom surface of the first pattern is lower than a bottom surface of the connection structure in a thickness direction of the insulation layer.
4. The memory device according to claim 1 , further comprising:
a second patterned conductive layer disposed on the insulation layer, the second patterned conductive layer comprising:
a bottom electrode disposed between the connection structure and the first memory material pattern; and
a second pattern disposed in the alignment mark trench.
5. The memory device according to claim 4 , wherein the second pattern is disposed between the first pattern and the second memory material pattern.
6. The memory device according to claim 4 , wherein the bottom electrode and the second pattern are separated from each other.
7. The memory device according to claim 4 , wherein the bottom electrode is disposed outside the connection hole.
8. The memory device according to claim 4 , wherein a bottom surface of the second pattern is lower than a bottom surface of the first pattern in a thickness direction of the insulation layer.
9. The memory device according to claim 4 , wherein a bottom surface of the second pattern and a bottom surface of the first pattern are coplanar.
10. The memory device according to claim 4 , wherein a top surface of the first pattern is higher than a top surface of the second pattern.
11. The memory device according to claim 1 , further comprising:
a patterned mask layer disposed on the patterned memory material layer, the patterned mask layer comprising:
a first mask pattern disposed on the first memory material pattern; and
a second mask pattern disposed in the alignment mark trench and disposed on the second memory material pattern.
12. The memory device according to claim 11 , wherein the second memory material pattern is disposed between the second mask pattern and the first pattern.
13. The memory device according to claim 11 , wherein the first mask pattern and the second mask pattern are separated from each other.
14. The memory device according to claim 11 , wherein the first mask pattern is disposed outside the connection hole.
15. The memory device according to claim 1 , wherein the connection structure and the first pattern are separated from each other.
16. The memory device according to claim 1 , wherein the first memory material pattern and the second memory material pattern are separated from each other.
17. The memory device according to claim 1 , wherein the first memory material pattern is disposed outside the connection hole.
18. The memory device according to claim 1 , wherein the patterned memory material layer is a magnetic tunnel junction (MTJ) film stack layer.
19. The memory device according to claim 1 , wherein the peripheral region comprises an alignment mark region.
20. The memory device according to claim 1 , wherein the connection structure is disposed between the first memory material pattern and the interconnection structure in a thickness direction of the insulation layer.