IP Library Granted Patent US 10,637,002
Granted Patent B2
US 10,637,002 · App. 16/133,905 · Granted Apr 28, 2020

Organic light emitting diode display panel, manufacturing method thereof, and organic light emitting diode display apparatus

Inventor: Bin Xu (Guangdong, CN)
Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
H01L51/5253H01L27/323G06F3/0412G06F2203/04103
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Quick Facts
Patent No.
US 10,637,002
App. No.
16/133,905
Granted
Apr 28, 2020
Kind
B2
Abstract

The present disclosure discloses an organic light emitting diode display panel, a manufacturing method thereof, and an organic light emitting diode display apparatus. The organic light emitting diode display panel may include a display region and a non-display region, and a surface of the non-display region filled with a sealant layer to smooth the surface of the non-display region. The non-display region of the display panel of the present disclosure may have a smooth surface. A peripheral wiring may be facilitated, and a process difficulty of the wiring may be reduced. Moreover, the sealant layer may absorb and disperse the stress between the layers, and may improve a de-lamination condition caused by an excessive stress.

Claims (75)

1. An organic light-emitting diode display panel comprising:

a display region, a non-display region, and an organic light-emitting layer;

wherein the display region corresponds to a position where the organic light-emitting layer is located in;

wherein a sealant layer is arranged on the non-display region, and the sealant layer is not arranged on the display region where the organic light-emitting layer is located in;

wherein an inorganic flat layer is formed on a surface of the display region and on at least a portion of a surface of the sealant layer; and

a touch electrode layer on the inorganic flat layer in the display region and at least a portion of non-display region.

2. The organic light-emitting diode display panel according to claim 1 , wherein

the non-display region comprises:

a device layer and at least one retaining wall disposed on the device layer, and the sealant layer is disposed on the retaining wall.

3. The organic light-emitting diode display panel according to claim 2 , wherein

the sealant layer covers the retaining wall and the device layer not covered by the retaining wall;

a recessed region in the non-display region relative to the display region is filled by the sealant layer, further to smooth a contact surface between the non-display region and the display region.

4. The organic light-emitting diode display panel according to claim 2 , wherein

the sealant layer is formed by a coating process;

the sealant layer is made of an organic material; and the organic material comprises any one of ultraviolet glue and frame glue.

5. The organic light-emitting diode display panel according to claim 1 , wherein

the non-display region comprises:

a device layer and at least one retaining wall disposed on the device layer;

the sealant layer covering the retaining wall and the device layer not covered by the retaining wall;

a recessed region in the non-display region relative to the display region being filled by the sealant layer, further to smooth a contact surface between the non-display region and the display region.

6. The organic light-emitting diode display panel according to claim 5 , wherein

the non-display region further comprises:

an encapsulation layer, the encapsulation layer extending from the display region to the non-display region; the encapsulation layer covering the retaining wall and a portion of the device layer; and

the sealant layer covers at least a portion of the encapsulation layer and the device layer not covered by the encapsulation layer; and the sealant layer is smoothly and transitionally connected with the encapsulation layer located in the display region, so as to for a smooth connection surface between the sealant layer and the surface of the encapsulation layer that is not covered.

7. The organic light-emitting diode display panel according to claim 6 , wherein

the encapsulation layer comprises:

a first inorganic layer, a second inorganic layer, and an organic layer disposed between the first inorganic layer and the second inorganic layer;

the first inorganic layer is formed on the device layer, and the first inorganic layer covers the retaining wall.

8. The organic light-emitting diode display panel according to claim 1 , wherein

the sealant layer is made of an organic material; and

the organic material comprises any one of ultraviolet glue and frame glue.

9. The organic light-emitting diode display panel according to claim 1 , wherein

the sealant layer is formed by a coating process.

10. An organic light-emitting diode display apparatus, wherein

the organic light-emitting diode display apparatus comprises:

an organic light-emitting diode display panel; the organic light-emitting diode display panel comprising:

a display region, a non-display region, and an organic light-emitting layer;

wherein the display region corresponds to a position where the organic light-emitting layer is located in;

wherein a sealant layer is arranged on the non-display region, and the sealant layer is not arranged on the display region where the organic light-emitting layer is located in;

wherein an inorganic flat layer is formed on a surface of the display region and at least a portion of the surface of the sealant layer; and

a touch electrode layer is arranged on the inorganic flat layer in the display region and at least a portion of non-display region.

11. The organic light-emitting diode display apparatus according to claim 10 , wherein

the non-display region comprises:

a device layer and at least one retaining wall disposed on the device layer, and the sealant layer is disposed on the retaining wall.

12. The organic light-emitting diode display apparatus according to claim 11 , wherein

the sealant layer covers the retaining wall and the device layer not covered by the retaining wall;

a recessed region of the non-display region relative to the display region is filled by the sealant layer, further to smooth a contact surface between the non-display region and the display region.

13. The organic light-emitting diode display apparatus according to claim 10 , wherein

the non-display region comprises:

a device layer and at least one retaining wall disposed on the device layer;

the sealant layer covering the retaining wall and the device layer not covered by the retaining wall;

a recessed region in the non-display region relative to the display region being filled by the sealant layer, further to smooth a contact surface between the non-display region and the display region.

14. The organic light-emitting diode display apparatus according to claim 13 , wherein

the non-display region further comprises:

an encapsulation layer, the encapsulation layer extending from the display region to the non-display region; the encapsulation layer covering the retaining wall and a portion of the device layer; and

the sealant layer covers at least a portion of the encapsulation layer and the device layer not covered by the encapsulation layer; and the sealant layer is smoothly and transitionally connected with the encapsulation layer located in the display region, so as to for a smooth connection surface between the sealant layer and the surface of the encapsulation layer that is not covered.

15. The organic light-emitting diode display apparatus according to claim 14 , wherein

the encapsulation layer comprises:

a first inorganic layer, a second inorganic layer, and an organic layer disposed between the first inorganic layer and the second inorganic layer;

the first inorganic layer is formed on the device layer, and the first inorganic layer covers the retaining wall.

16. The organic light-emitting diode display apparatus according to claim 10 , wherein

the sealant layer is formed by a coating process, and

the sealant layer is made of an organic material; and

the organic material comprises any one of ultraviolet glue and frame glue.

17. A manufacturing method of an organic light-emitting diode display panel, wherein the method of fabricating comprises:

preparing the substrate;

forming an organic light-emitting layer, a display region, and a non-display region of the display panel on the substrate;

arranged a sealant layer on the non-display region, not arranged on the display region where the organic light-emitting layer is located in;

wherein the display region corresponds to a position where the organic light-emitting layer is located in;

wherein an inorganic flat layer is formed on a surface of the display region and at least a portion of the surface of the sealant layer; and

a touch electrode layer is arranged on the inorganic flat layer in the display region and at least a portion of non-display region.

18. The organic light-emitting diode display panel according to claim 1 , wherein

the sealant layer has a smoothly curved surface without any corners.

19. The organic light-emitting diode display panel according to claim 1 , wherein

the touch electrode layer extend to the non-display region.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2018
From: XU, BIN
To: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Reel/Frame 046905/0164 →
Priority Claims (1)
CN 2018 1 0475342 · May 17, 2018 · national
Continuity (2)
Continuation PCTCN2018096924 · Jul 25, 2018
Related Publication 20190355929A1 · Nov 21, 2019