IP Library › Granted Patent US 1,063,944
Granted Patent S1
US 1,063,944 · App. 29/833,453 · Granted Feb 25, 2025

Housing module for an electronic device

Inventors: Jody Akana (San Francisco, CA); Molly Anderson (San Francisco, CA); Bartley K. Andre (Palo Alto, CA); Shota Aoyagi (San Francisco, CA); Anthony Michael Ashcroft (San Francisco, CA); Marine C. Bataille (San Francisco, CA); Jeremy Bataillou (San Francisco, CA); Daniele De Iuliis (San Francisco, CA); Markus Diebel (San Francisco, CA); M. Evans Hankey (San Francisco, CA); Julian Hoenig (San Francisco, CA); Richard P. Howarth (San Francisco, CA); Jonathan P. Ive (San Francisco, CA); Julian Jaede (San Francisco, CA); Duncan Robert Kerr (San Francisco, CA); Peter Russell-Clarke (San Francisco, CA); Benjamin Andrew Shaffer (San Jose, CA); Mikael Silvanto (San Francisco, CA); Christopher J. Stringer (Woodside, CA); Joe Sung Ho Tan (Vienna, AT); Clement Tissandier (San Francisco, CA); Eugene Antony Whang (San Francisco, CA); Rico Zörkendörfer (San Francisco, CA)
Assignee: Apple Inc.
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Quick Facts
Patent No.
US 1,063,944
App. No.
29/833,453
Granted
Feb 25, 2025
Kind
S1
Claims (1)

The ornamental design for a housing module for an electronic device as shown and described.

Continuity (5)
Continuation 29802000 · Aug 2, 2021
Continuation 29749438 · Sep 4, 2020
Continuation 29691815 · May 20, 2019
Continuation 29655032 · Jun 29, 2018
Continuation 29612835 · Aug 4, 2017
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