Diodes offering asymmetric stability during fluidic assembly
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
1. A method for assembling a display device, the method comprising:
providing a substrate, wherein the substrate includes at least one groove extending blow a top surface of the substrate;
providing a suspension including a carrier liquid and a plurality of post enhanced diodes, wherein each of the post enhanced diodes includes a post extending from a top surface of a diode structure; and
orienting the plurality of post enhanced diodes in relation to the top surface of the substrate by flowing the suspension over the at least one groove in the top surface of the substrate, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a more likely non-inverted orientation, and wherein an orientation of each of a post enhanced diode where the post extends toward the substrate is a less likely inverted orientation.
2. The method of claim 1 , wherein the at least one groove is configured such that a post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the non-inverted orientation is more mechanically stable than the post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the inverted orientation.
3. The method of claim 1 , wherein the post is a non-metallic post.
4. The method of claim 1 , wherein the post is a metallic post.
5. The method of claim 1 , wherein the post is selected from a group consisting of: a non-conductive post, and a conductive post.
6. The method of claim 1 , wherein the substrate further includes a plurality of wells extending below the top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode, the method further comprising:
flowing the suspension over the top surface of the substrate such that each of the of the plurality of wells is filled with a respective one of the plurality of post enhanced diodes in the non-inverted orientation.
7. The method of claim 6 , wherein at least one sidewall of a line extending into the substrate is tapered.
8. The method of claim 1 , wherein the at least one groove extends in a line across a portion of the substrate, and wherein the line is selected from a group consisting of: a straight line, and a curvilinear line.
9. The method of claim 8 , wherein at least one sidewall of the line extending into the substrate is substantially vertical.
10. A method for assembling a display device, the method comprising:
providing a substrate, wherein the substrate includes a plurality of wells extending into a top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode;
providing a suspension including a carrier liquid and a plurality of post enhanced diodes, wherein each of the plurality of the post enhanced diodes includes a post extending from a top surface of a diode structure; and
orienting the plurality of post enhanced diodes in relation to the top surface of the substrate by flowing the suspension over the plurality of wells, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of a post enhanced diode where the post extends toward the substrate is an inverted orientation, wherein one of the plurality of post enhanced diodes deposited in a respective one of the plurality of wells is more mechanically stable in the non-inverted orientation than in the inverted orientation.
11. The method of claim 10 , wherein the substrate further includes at least one groove extending into the top surface of the substrate, the method further comprising:
flowing the suspension over the at least one groove in the top surface of the substrate, wherein flowing past the at least one groove makes the non-inverted orientation more likely than the inverted orientation.
12. The method of claim 11 , wherein the at least one groove is configured such that a post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the non-inverted orientation is more mechanically stable than the post enhanced diode carried in the suspension across the at least one groove in the surface of the substrate in the inverted orientation.
13. The method of claim 11 , wherein the at least one groove extends in a line across a portion of the substrate, and wherein the line is selected from a group consisting of: a straight line, and a curvilinear line.
14. The method of claim 13 , wherein at least one sidewall of the line extending into the substrate is tapered.
15. The method of claim 13 , wherein at least one sidewall of the line extending into the substrate is substantially vertical.
16. The method of claim 10 , wherein the post is a non-metallic post.
17. The method of claim 10 , wherein the post is a metallic post.
18. The method of claim 10 , wherein the post is a non-conductive post.
19. The method of claim 10 , wherein the post is a conductive post.
20. The method of claim 10 , the method further comprising:
flowing the suspension over the top surface of the substrate such that each of the of the plurality of wells is filled with a respective one of the plurality of post enhanced diodes in the non-inverted orientation.